Patent classifications
C22C30/06
ELECTRICAL CONNECTOR
An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.
ELECTRICAL CONNECTOR
An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.
Magnetocaloric alloys useful for magnetic refrigeration applications
This invention relates to magnetocaloric materials comprising alloys useful for magnetic refrigeration applications. In some embodiments, the disclosed alloys may be Cerium, Neodymium, and/or Gadolinium based compositions that are fairly inexpensive, and in some cases exhibit only 2.sup.nd order magnetic phase transitions near their curie temperature, thus there are limited thermal and structural hysteresis losses. This makes these compositions attractive candidates for use in magnetic refrigeration applications. Surprisingly, the performance of the disclosed materials is similar or better to many of the known expensive rare-earth based magnetocaloric materials.
PROBE PIN MATERIAL INCLUDING Ag-Pd-Cu-BASED ALLOY
A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.
PROBE PIN MATERIAL INCLUDING Ag-Pd-Cu-BASED ALLOY
A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.
Material obtained by compaction and densification of metallic powder(s)
The invention relates to a compacted and densified metal material having one or more phases formed of an agglomerate of grains, the cohesion of the material being provided by bridges formed between grains, said material having a relative density higher than or equal to 95% and preferably higher than or equal to 98%.
Material obtained by compaction and densification of metallic powder(s)
The invention relates to a compacted and densified metal material having one or more phases formed of an agglomerate of grains, the cohesion of the material being provided by bridges formed between grains, said material having a relative density higher than or equal to 95% and preferably higher than or equal to 98%.
GALVANIZED STEEL SHEET HAVING EXCELLENT PLATING ADHESION AND CORROSION RESISTANCE, AND MANUFACTURING METHOD THEREFOR
Provided is a galvanized steel sheet having excellent plating adhesion, having a plated layer with improved friction characteristics by means of a predetermined level of Fe elution, and having excellent corrosion resistance; and a manufacturing method therefor.
Lead-free solder composition
An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.
Lead-free solder composition
An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.