The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.01 parts by weight or more and 10 parts by weight or less of a compound having a structure represented by the following formula (A) or (B) relative to 100 parts by weight of the acrylic copolymer:

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The present invention aims to provide a resin foam, a resin foam sheet, an adhesive tape, a member for a vehicle, and a member for a building that are capable of exhibiting very high sound insulation properties. Provided is a resin foam having a multitude of cells, the resin foam containing: a thermoplastic resin; and a plasticizer, the resin foam having a minimum loss factor of a primary anti-resonance frequency in the range of 20° C. to 60° C. of 0.05 or higher and a secondary anti-resonance frequency in the range of 20° C. to 60° C. of 300 to 800 Hz as measured by mechanical impedance measurement (MIM) in conformity with JIS G0602.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.

A dielectric welding film capable of achieving a tight welding through a short period of dielectric heating, and a welding method using the dielectric welding film are provided. The dielectric welding film is configured to weld a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a thermoplastic resin as an A component and a dielectric filler as a B component and satisfying the conditions (i) and (ii): (i) a melting point or softening point measured in accordance with JIS K 7121 (1987) is in a range from 80 to 200 degrees C.; and (ii) heat of fusion measured in accordance with JIS K 7121 (1987) is in a range from 1 to 80 J/g.

An adhesive structure is provided, which includes a plastic substrate, and an adhesive layer on the plastic substrate. The adhesive layer includes a releasable adhesive. The adhesive layer has a Young's modulus of 5 MPa to 14 MPa and an adhesive force to glass of 200 gf/25 mm to 2000 gf/25 mm. The adhesive structure can be used to transfer a device.

A screen protector application kit includes a glass-based substrate (110) having an adhesive belt (270) and an adhesive container (478) of an uncured adhesive composition. The adhesive belt (270) includes a first major surface (272) adhered to the glass-based substrate (110), a second major surface (274), a distal edge (276) extending between the first major surface (272) and the second major surface (274), and a proximal edge (278) extending between the first major surface (272) and the second major surface (274). The uncured adhesive composition includes 30 wt % to 99.9 wt % of at least one of: (i) a monomer; and (ii) an oligomer; and 0.01 wt % to 10 wt % of a visible-light photoinitiator. The uncured adhesive composition may further include 0.1 wt % to 10 wt % of a co-initiator. The uncured adhesive composition may further include 0.1 wt % to 5 wt % of an oxygen inhibitor.

The insulation adhesive film material is composed of a three-layer structure, its insulation polymer composite is supported by a thin film material, and a surface of the insulation polymer composite is covered with a layer of protective film. A release force of a support film is 25-60 μN/mm, and a release force of the protective film is 2-60 μN/mm. A thickness of the insulation polymer composite is 1-300 μm. The insulation adhesive film material is prepared as follows: after a high molecular polymer, an inorganic filler, a high molecular polymer curing agent, a molding auxiliary agent, and a solvent are mixed, dispersion technologies such as ball milling, sand milling, ultrasound are conducted to prepare an electronic paste of the insulation polymer composite, and the electronic paste is then applied to a surface of a support film material, and bonded with the protective film to form the insulation adhesive film material.

A two-part epoxy coating composition for producing an adherent coating for articles such as large liquid storage tanks. The two-part epoxy coating composition includes a first liquid comprising a polyepoxide having a described formula and having an estrogenic agonist activity less than that of bisphenol S, and a second liquid comprising a curing agent configured to react with the polyepoxide under ambient conditions.

Provided is an optical laminate having excellent resistance to the pressure from the surface and a display device including the same. The optical laminate includes a surface protective layer, a first pressure sensitive adhesive layer, a light absorption anisotropic layer, and a second pressure sensitive adhesive layer in this order, in which an indentation elastic modulus of the first pressure sensitive adhesive layer is greater than an indentation elastic modulus of the light absorption anisotropic layer, the light absorption anisotropic layer is a layer formed of a composition for forming a light absorption anisotropic layer containing a liquid crystal compound and a dichroic substance, and a thickness of the light absorption anisotropic layer is less than 5 μm.

A bus bar, which includes a metal bar made of an electrically conductive metal material; a bandage member configured to surround the metal bar except for both ends of the metal bar; and an insulating tube configured to surround the metal bar and the bandage member together, wherein the bandage member is made of a metal wire having a surface coated with a coating material having insulation and fire resistance.