An ultrasonic actuator with increased radiating surface is presented. The increased radiating surface is provided by a plurality of piezoelectric stacks that are each compressed by action of a respective bolt against a common backing structure of the actuator. According to one aspect, each of the stacks includes a plurality of stacked piezoelectric rings with the respective bolt arranged through the central opening of the rings. According to another aspect, one or both of the backing structure and the horn of the actuator include tuning grooves and/or tuning slots to produce amplitude uniformity of displacement through the actuator. According to another aspect, the radiating surface has a symmetrical shape about an axial direction of the actuator with a lateral dimension that is in a range between one quarter and one half of the wavelength of operation of the actuator.

A piezoelectric element includes a piezoelectric element body including a first principal surface and a second principal surface opposing each other, and a plurality of external electrodes disposed on the first principal surface. A vibration member includes a third principal surface opposing the second principal surface. The piezoelectric element is joined to the third principal surface. A wiring member is electrically connected to the piezoelectric element. The wiring member includes a region located on the plurality of external electrodes and joined to the plurality of external electrodes. The region of the wiring member monolithically covers the plurality of external electrodes when viewed from a direction orthogonal to the first principal surface.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.

An ultrasonic transducer array including a substrate, a membrane overlying the substrate, the membrane configured to allow movement at ultrasonic frequencies, and a plurality of anchors connected to the substrate and connected to the membrane. The membrane includes a piezoelectric layer, a plurality of first electrodes, and a plurality of second electrodes, wherein each ultrasonic transducer of a plurality of ultrasonic transducers includes at least a first electrode and at least a second electrode. The plurality of anchors includes a first anchor including a first electrical connection for electrically coupling at least one first electrode to control circuitry and a second anchor including a second electrical connection for electrically coupling at least one second electrode. The ultrasonic transducer array could be either a two-dimensional array or a one-dimensional array of ultrasonic transducers.

An ultrasound probe and ultrasound diagnostic apparatus that achieve high transmission/reception sensitivity and wide frequency band are provided. The ultrasound probe includes a pMUT array in which a plurality of pMUTs are arranged. The pMUTs include first pMUTs for ultrasound transmission and pMUTs for ultrasound wave reception having a structure different from that of the first pMUTs. The cell region of each first pMUT and the cell region of each second pMUT are separated from each other in the ultrasound wave radiation plane.

An ultrasound probe includes a piezoelectric section to transmit and receive ultrasound, wherein the piezoelectric section includes a plurality of laminated piezoelectric layers each of which includes piezoelectric members and non-piezoelectric members both of which are arranged alternately in parallel to each other in an arrangement direction, and wherein the arrangement direction of the piezoelectric members and the non-piezoelectric members in at least one piezoelectric layer of the plurality of laminated piezoelectric layers is different from that in other one piezoelectric layer of the plurality of laminated piezoelectric layers.

An armor plate system includes an integrated damage detector which may permit field testing of an armor plate. The system includes a ceramic plate and a piezoelectric transducer attached to lateral face of the ceramic plate. The piezoelectric transducer may apply a signal to the ceramic plate and receive a reflected signal. The applied signal may form a compression wave. An ultrasonic signal may be applied.

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.