An implantable medical instrument for use within a body includes a container that has an opening and holds a medicinal solution, and a soft portion that closes the opening. The medical instrument further includes a power receiver that receives power transmitted externally, and a light emitter that emits light by way of the power received by the power receiver. The light emitter includes at least one of a first light emitter that emits light having a center wavelength of 600 nm or more and 1100 nm or less, and a second light emitter that emits light having a center wavelength of 400 nm or more and 480 nm or less.

Proposed are a method and a system for removing L-FC in a plasma etching process, in which L-FC, which is condensed on a wafer, an electrode, a substrate, a head, or the like, is removed by using infrared or ultraviolet rays in a plasma etching process using an L-FC precursor.

A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

An apparatus for transferring a substrate to a substrate processing chamber is provided. The apparatus comprises: a substrate transfer chamber having a floor provided with a first magnet and a sidewall connected to the substrate processing chamber and having an opening through which a substrate is loaded into and unloaded from the substrate processing chamber; a substrate transfer module including a substrate holder configured to hold the substrate and a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force; and a heating device configured to heat the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module.

A cryopump includes at least one cryopanel including a photocatalyst layer on a surface thereof, and an excitation light source that is disposed so as to irradiate the photocatalyst layer with excitation light that activates the photocatalyst layer.

An assembly comprising at least two elements in a movable arrangement relative to each other for performing a first function of the assembly is furthermore equipped with an anti-biofouling system for subjecting at least an area of the assembly that is to be at least partially exposed to water during at least a part of its lifetime to an anti-biofouling action as an additional function of the assembly, different from the first function of the assembly. The anti-biofouling system comprises one or more light sources for emitting anti-biofouling light, and the anti-biofouling system is adapted to realize coverage of the area with the anti-biofouling light on the basis of the movable arrangement of the at least two elements relative to each other for performing the first function of the assembly.

A method of processing a plurality of substrates includes immersing the plurality of substrates into a bath solution contained in a bath chamber; generating gas bubbles in the bath solution; projecting light from a light source toward the bath chamber; generating light sensor data by capturing light emanating off the bath chamber after interacting with the gas bubbles with a light sensor; and converting the light sensor data into a metric for the bath solution.

A cryopump includes at least one cryopanel including a photocatalyst layer on a surface thereof, and an excitation light source that is disposed so as to irradiate the photocatalyst layer with excitation light that activates the photocatalyst layer.

A method for cleaning a semiconductor fabrication equipment part having gas holes used in single-wafer type semiconductor fabrication equipment for processing semiconductor wafers, wherein the semiconductor fabrication equipment part having gas holes is formed of aluminum or an aluminum alloy, and has a distribution plate having a plurality of gas holes, the method including: a step (1) of scanning a gas injection surface of the distribution place, which is a surface facing the wafer, with a laser beam; and a step (2) of bringing the gas injection surface and insides of the gas holes into contact with a cleaning liquid containing an inorganic acid.

A system for removing a coating from an underlying layer can include a wave-based weakening system configured to weaken the coating by decreasing a coupling force between the coating and the substrate, a coating removal mechanism configured to remove the weakened coating from the underlying layer, and a sensor configured to determine a property associated with the coating. A method for removing a coating from an underlying layer can include generating a weakened coating and removing the weakened coating.