A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-θ lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.

A method comprising applying braze to a joint location of two work pieces and applying local heating to the joint location of the two work pieces until braze melting temperature is achieved to melt the braze while maintaining temperature of more remote portions of each work piece. The method includes reducing heating of the braze to form a braze joint joining the joint location of the two work pieces.

A method for selectively adhering braze powders to a surface comprises applying a braze powder to a surface, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder along the predetermined path such that the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder, that is, the braze powder not selectively heated by the laser, is removed from the surface.

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes “selective” intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.

An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

A laser soldering system and a method for monitoring a laser soldering process by means of a monitoring device of the laser soldering system, wherein a solder ball is dispensed onto a solderable surface of a substrate by means of a solder ball feeding device of the laser soldering system, wherein the solder ball is at least partially melted by means of a laser device of the laser soldering system, wherein, during the laser soldering process, a light signal is formed which is detected by means of an optical detection unit of the monitoring device, wherein the light signal is dispersed into a spectrum of the light signal by means of a spectroscope device of the monitoring device, wherein the spectrum is analyzed by means of a processing device of the monitoring device, and it is identified on the basis of a composition of the spectrum whether or not a burning of the substrate has occurred during the laser soldering process.