A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.

Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

A method of pretinning a core wire for a guidewire having an elongate axis, comprising placing a ball of solder within a pocket in a soldering block; melting the ball of solder; holding a core wire over the ball of solder, with the elongate axis in a horizontal orientation; lowering a portion of the core wire into the ball of solder while maintaining the elongate axis in a horizontal orientation; removing the core wire from the ball of solder.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.