Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

A method for joining by welding or gluing joining elements to components, with the following steps: preparation of a joining element, which comprises a first joining surface, and preparation of a component, which comprises a second joining surface; preparation of the first or second joining surface; and carrying out the joining process, in which the joining element is joined to the component; wherein the preparatory step comprises at least one of the following cleaning methods for cleaning the first or second joining surface: a TIG arc method, a plasma gas cleaning method, and a snow jet method.

Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.

Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.

A vertical bundle air-cooled heat exchanger, a finned tube assembly for an air cooled condenser and method for forming the same, and a system for removing thermal energy generated by radioactive materials. In one aspect, an air cooled condenser sized for industrial and commercial application includes an inlet steam distribution header for conveying steam, a condensate outlet header for conveying condensate, an array of tube bundles each having a plurality of finned tube assemblies having a bare steel tube with an exposed outer surface and a set of aluminum fins brazed directly onto the tube by a brazing filler metal. The steel tubes may be spaced apart by the aluminum fins and have an inlet end fluidly coupled to the inlet steam distribution header and an outlet end fluidly coupled to the outlet header. A forced draft fan may be arranged to blow air through the tube bundles.

An oxide removing apparatus includes: a chamber; a discharge section configured to discharge a fluid from the chamber; a heating section configured to heat an object; a reducing gas supply section having a gasification device configured to produce a reducing gas; and a controller. The controller controls each component such that, after substantially all the fluid in the chamber is discharged, the reducing gas substantially fills the chamber at a pressure that is equal to or higher than 1000 Pa and lower than a saturated vapor pressure of the reducing gas, while the object is heated. A method for manufacturing an oxide-removed object includes introducing the object into the chamber, heating to a predetermined temperature, discharging substantially all the fluid from the chamber, then filling the chamber with the reducing gas at the pressure that is equal to or higher than 1000 Pa and lower than the saturated vapor pressure of the reducing gas, and reducing oxides in the object, which is heated to the predetermined temperature, in an the atmosphere of the reducing gas.

The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected. It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

A carrier boat for die package flux cleaning, including: a body having at least one pair of substantially parallel sides, the body comprising one or more die package receptacles each oriented at a non-parallel angle relative to the substantially parallel sides of the body such that, when a die package is seated in a die package receptacle of the one or more die package receptacles, a first pair of opposing sides of a die of the die package are substantially perpendicular to the substantially parallel sides,

A brazing sheet may be used for brazing under an atmosphere of an inert gas without flux. The brazing sheet may include at least three layers. The at least three layers may include a core material, a brazing material layer, and an intermediate layer. The at least three layers may be cladded by an outermost layer of the brazing material layer. The intermediate layer may be disposed on a face of the core material. The core material may be composed of a first aluminum alloy including at least one of (i) 0.20 weight % to 1.0 weight % of Cu, (ii) 0.8 weight % to 1.8 weight % of Mn, and (iii) 0.25 weight % to 1.5 weight % of Mg. The intermediate layer may be composed of a second aluminum alloy including 0.20 weight % or less of each of Si and Fe and 0.10 weight % or less of each of Cu, Mn, and Cr.