B23K20/023

PROCESSING METHOD OF WORKPIECE
20230031772 · 2023-02-02 ·

A processing method of a workpiece includes an integration step of heating and compression bonding a thermocompression bonding sheet to an annular frame that has an opening to receive the workpiece therein and to the workpiece received in the opening, whereby the annular frame and the workpiece are integrated via the thermocompression bonding sheet, and a processing step of processing the workpiece integrated with the annular frame via the thermocompression bonding sheet. In the integration step, the thermocompression bonding sheet is pressed against the annular frame that has been heated by a heat table with a heat source included therein, by a heat roller with a heat source included therein while being heated by the heat roller, whereby the thermocompression bonding sheet is fixed to the annular frame.

SUBSTRATE FOR EPITAXIAL GROWTH AND METHOD FOR PRODUCING SAME

It is an object to provide a substrate for epitaxial growth having a metal base material laminated with a copper layer. On a surface of the copper layer, an area occupied by crystal grains having crystal orientations other than a (200) plane present within 3 μm from the surface can be less than 1.5%. A surface roughness along a same direction as a rolling direction per unit length of 60 μm when measured by AFM can be Ra1<10 nm.

STEEL JOINED BODY AND METHOD FOR MANUFACTURING THE SAME

A steel joined body includes a plurality of steels joined together, the plurality of steels including a joint interface having a carbon concentration of 0.20 mass % or more and 2.10 mass % or less, and the steel joined body including a concentration gradient layer having a carbon concentration decreasing with distance from the joint interface.

Methods and assemblies for bonding airfoil components together

During a bonding process, a tip cap and an airfoil base are provided. The tip cap is arranged on the airfoil base. The tip cap is diffusion bonded to the airfoil base.

SEQUENCES AND EQUIPMENT FOR DIRECT BONDING
20230067677 · 2023-03-02 ·

Bonding tools and related systems are provided for surface cleaning and direct bonding. A bonding tool includes a support configured to hold a first element, and is further configured to bond a second element to the first element by way of direct bonding. A laser cleaning assembly is configured to clean the first and/or second element prior to bonding, and can be integrated with the bonding tool. The laser cleaning can also clean surfaces of the bonding tool and/or a robotic end effector for delivering the second element. Methods and sequences for surface cleaning and direct bonding using the systems are also disclosed.

Method and system for fusing pipe segments
11602802 · 2023-03-14 ·

A system for securing first and second metal workpieces to a central metal workpiece located therebetween. The system includes clamps to secure the first and second metal workpieces in coaxial alignment with the central metal workpiece, which is rotatable about its axis. Heating elements heat opposed ends of the first metal workpiece and the central metal workpiece, and opposed ends of the second metal workpiece and the central metal workpiece, to a hot working temperature. While the opposed ends are at the hot working temperature, the heating elements are removed. The opposed end of the first metal workpiece is urged against the end opposed thereto of the rotating central metal workpiece, while the central metal workpiece rotates. At the same time, the rotating central metal workpiece is pulled against the second metal workpiece to engage the opposed ends thereof with each other. The workpieces are then allowed to cool.

Metallized Components And Surgical Instruments

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

METHOD OF BONDING METALLIC COMPONENTS TO FORM MACHINING PREFORM

A method of bonding two or more metallic components into a single piece. The bonding surfaces of the metallic components are protected from reaction with the environment. A force is applied to the metallic components to push the bonding surfaces together. Simultaneous with applying the force, an electric current is passed through the bonding surfaces to joule heat and weld the bonding surfaces together to form the single piece. The bonding surfaces may be protected by plating with a noble metal, applying a coating, shielding with a noble gas, or placing into a vacuum. A press may be used to apply the force. The force and the electric current may be sufficient to push out metal around the joint of the bonding surfaces, and at least one of the bonding surfaces may be drafted to facilitate pushing out the metal. The electric current may be pulsed to induce electroplasticity.

Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding

A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.