The present invention relates to a nickel-based superalloy for diffusion bonding, which includes a surface depletion layer in a state in which an aluminum (Al) or titanium (Ti) content is depleted, the surface depletion layer being formed to a depth of 50 μm or less from a surface for diffusion bonding, and a method for diffusion bonding using the same.

A wafer processing method for processing a wafer formed on a front surface thereof with a plurality of devices having projection-shaped electrodes, the devices being partitioned by streets, includes a cutting step of holding a back surface of the wafer by a holding surface of a chuck table and cutting head portions of the projection-shaped electrodes by a cutting tool slewed in parallel to the holding surface, to make uniform the electrodes in height and expose metallic surfaces; a thermocompression bonding sheet laying step of laying a thermocompression bonding sheet on the front surface of the wafer; a thermocompression bonding step of heating and pressing the thermocompression bonding sheet to perform thermocompression bonding; and a peeling step of peeling off the thermocompression bonding sheet from the wafer, before dividing the wafer into individual device chips and bonding the electrodes to a circuit board.

A method and an apparatus for the pressure-sintering connection of a first and a second connection provide a frame element lowerable onto a frame surface surrounding the supporting surface, having a sintering ram lowerable lowered from the normal direction onto the second connection partner and exerts pressure thereon, and converting a sintering paste between the connection partners into a sintered metal, and having an auxiliary apparatus for the arrangement of a separating film for the peripheral covering of the frame surface and the connection partners. This arrangement of the separating film produces an inner region bounded by the frame element and bounded by a separating film portion within the frame element and by the supporting surface, and injection opening and an outlet opening allow a second gas to flush through said inner region from the injection opening to the outlet opening and displace a first gas.

The method comprises applying a spot load to a joint part between a first metal material and a second metal material in a state where sites to form the joint part are superposed on each other. When a total thickness of the first metal material and the second metal material at the joint part before bonding is defined as T.sub.0 mm, the total thickness thereof after bonding is defined as T.sub.1 mm, and T.sub.0/T.sub.1=R is defined as a reduction ratio, the reduction ratio R is 1.4 or more.

A titanium product includes an inner layer portion and a surface layer portion joined to the inner layer portion. The surface layer portion has a composition consisting of, by mass %, O: 0.4% or less, Fe: 0.5% or less, Cl: 0.020% or less, the balance: Ti and impurities. The inner layer portion 3 has pores and a composition consisting of, by mass %, O: 0.4% or less, Fe: 0.5% or less, Cl: more than 0.020% and 0.60%, the balance: Ti and impurities. The area fraction of the pores in the inner layer portion in a cross-section perpendicular to the longitudinal direction of the titanium product is more than 0% and not more than 30%. The Cl content (Cl.sub.I) of the inner layer portion, a thickness (t.sub.S) of the surface layer portion, and a thickness (t.sub.I) of the inner layer portion satisfy the expression [Cl.sub.I≤0.03+0.02×t.sub.S/t.sub.I].

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a3. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0.sub.Cu and I0.sub.CLAD, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2.sub.Cu and I2.sub.CLAD, respectively, I0.sub.Cu<20%, I2.sub.Cu=70 to 90%, and I0.sub.CLAD<20%, I2.sub.CLAD=70 to 90% and I0.sub.CLAD−I0.sub.Cu<13%.

Hydrogen purification devices and their components are disclosed. In some embodiments, the devices may include at least one foil-microscreen assembly disposed between and secured to first and second end frames. The at least one foil-microscreen assembly may include at least one hydrogen-selective membrane and at least one microscreen structure including a non-porous planar sheet having a plurality of apertures forming a plurality of fluid passages. The planar sheet may include generally opposed planar surfaces configured to provide support to the permeate side. The plurality of fluid passages may extend between the opposed surfaces. The at least one hydrogen-selective membrane may be metallurgically bonded to the at least one microscreen structure. In some embodiments, the devices may include a permeate frame having at least one membrane support structure that spans at least a substantial portion of an open region and that is configured to support at least one foil-microscreen assembly.

Steel sheet low in cost and improved in fatigue characteristics without causing a drop in the cold formability, characterized in that it comprises an inner layer and a hard layer on one or both surfaces of the inner layer, a thickness of the hard layer is 20 μm or more and 40% or less of the thickness of the steel sheet, an average micro-Vickers hardness of the hard layer is 240 HV or more and less than 400 HV, an amount of C of the hard layer is 0.4 mass % or less, an amount of N is 0.02 mass % or less, a variation of hardness measured by a nanoindenter at a depth of 10 from the surface of the hard layer is a standard deviation of 2.0 or less, an average micro-Vickers hardness of the inner layer is 80 HV or more and less than 400 HV, a volume rate of carbides contained in the inner layer is less than 2.00%, and the average micro-Vickers hardness of the hard layer is 1.05 times or more the average micro-Vickers hardness of the inner layer.

In a brazing sheet manufacturing method, a cladding slab is prepared by overlaying at least a core-material slab composed of an aluminum material and a filler-material slab composed of an Al—Si series alloy, in which a metal element that oxidizes more readily than Al is included in at least one of the slabs. A clad sheet is prepared by hot rolling this cladding slab, which then has at least a core material layer composed of the core-material slab and a filler material layer composed of the filler-material slab and disposed on at least one side of the core material. Then, a surface of the clad sheet is etched using a liquid etchant that contains an acid. Subsequently, the clad sheet is cold rolled to a desired thickness. In flux-free brazing, such a brazing sheet is capable of curtailing degradation in brazeability caused by fluctuations in dew point and oxygen concentration.

Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.