Patent classifications
B23K20/2336
Welding Device and Welding Method for Producing a Material Bond Connection between a Conductor and a Connecting Part
The subject matter relates to a welding device as well as a welding method for producing a material bond connection between a conductor (10) and a connecting part (8), with at least one ultrasonic welding tool (4), wherein at least part of a contact surface (18) of the connecting part (8) contacts at least part of a contact surface (16) of the ultrasonic welding tool (4).
METHOD FOR MANUFACTURING LIQUID-COOLING JACKET AND FRICTION STIR WELDING METHOD
The present invention includes: a primary joining process in which a coarse portion having a predetermined width is formed in the vicinity of a step side face within a plasticized region while the rotary tool is being moved one round along a first butted portion to perform friction stirring in a state that a tip of a tip side pin of a rotary tool being rotated is inserted to the same depth as or slightly deeper than a step bottom face and an outer circumferential face of a base side pin is in contact with a front face of a sealing body and the tip side pin is slightly in contact with at least an upper portion of a jacket body and an inspection process in which a passed position of the tip side pin is specified by performing, a flaw detection to detect the coarse portion.
ULTRASONIC JOINING HORN
An ultrasonic joining horn disclosed herein can generate ultrasonic vibration in a predetermined vibration direction and includes a base portion, a stand portion that rises from an upper surface of the base portion, and a pressure contact portion formed of a plurality of protrusions that protrude from an upper surface of the stand portion. Each of the protrusions is formed into a pyramid shape or a truncated pyramid shape, the protrusions are arrayed, and when viewed from top, at least a portion of a peripheral edge of a portion in which the protrusions are arrayed has a zigzag shape. The zigzag portion is formed along at least one of the vibration direction and a perpendicular direction to the vibration direction. The upper surface of the base portion has an exposed surface on which the stand portion is not formed.
Diffusion bonding with a bonding surface coating material
A method of diffusion bonding metal or metal alloy containing workpieces, comprises (a) coating the bonding surfaces of the metal or metal alloy containing workpieces with a layer of a coating material, (b) abrading the coated bonding surfaces to remove surface oxide, the coating material being in liquid form, (c) removing excess coating material or excess abraded metal or metal alloy containing workpiece material from the coated bonding surfaces, and (d) diffusion bonding the coated bonding surfaces of the metal or metal alloy containing workpieces together. The coating material is operable to form a stable barrier on the bonding surfaces of the metal or metal alloy containing workpieces under ambient conditions, and evaporates from the bonding surfaces under diffusion bonding conditions. There is also a bonded workpiece formed using the method of diffusion bonding metal or metal alloy containing workpieces.
Systems and methods for friction bit joining
A tool for friction bit joining a workpiece material includes a bit with a tapered pin and a non-cutting tip. The bit has a top surface opposite the pin with at least one feature recessed in, or extending from, the top surface and configured to transmit torque to the bit to rotate the bit around a rotational axis.
Dissimilar metal joint including flame-retardant magnesium alloy layer
Provided is a multimaterial joint material that contributes to multimaterialization and a reduction in weight of a transport apparatus, the multimaterial joint material being configured from: a flame-retardant magnesium alloy; and a metal or alloy selected from the group consisting of aluminum alloys, titanium alloys, stainless steel, and steel. This multimaterial joint material is such that two or more layers of different types of metal materials are joined, wherein the multimaterial joint material is characterized in that: of the two or more layers of metal materials, at least one layer comprises a flame-retardant magnesium alloy, and another layer comprises a metal or alloy selected from the group consisting of aluminum alloys, titanium alloys, stainless steel, and steel; and the two or more layers of metal materials are joined together across the entire surface of joining surfaces that overlap each other.
ROLLED (FeCoNiCrRn/Al)-2024Al COMPOSITE PANEL AND FABRICATION METHOD THEREOF
Disclosed are a rolled (FeCoNiCrR.sub.n/Al)-2024Al composite panel and a preparation method therefor. The preparation method involves taking pure aluminum as a matrix, adding an FeCoNiCrR.sub.n medium-entropy alloy with a high strength and toughness as an reinforcing phase to prepare an FeCoNiCrR.sub.n/Al composite material, then laminating the FeCoNiCrR.sub.n/Al composite material with aluminum alloy 2024, and preparing the (FeCoNiCrR.sub.n/Al)-2024Al composite board by means of hot-rolling recombination, which solves the problem that high-strength aluminum matrix composites (AMCs) are prone to instantaneous breakability and low ductility, thereby improving the overall performance of the material. The present disclosure adopts microwave sintering (MWS) to fabricate a medium-entropy alloy-reinforced AMC, and adopts hot-roll bonding to fabricate the (FeCoNiCrR.sub.n/Al)-2024Al metal composite panel. The composite panel fabricated by the present disclosure has excellent comprehensive mechanical properties, and has high application values for promoting the application of modern lightweight and high-efficiency industrial materials in aerospace, new energy vehicles, and the like.
Joining method
Provided is a joining method that can prevent a plastic flowing material from flowing out from a butt section and that can reduce the thickness and weight of metal members. The joining method is for joining a first metal member and a second metal member by using a rotary tool comprising a stirring pin, and is characterized in that: the stirring pin comprises a flat surface perpendicular to the rotation axis of the rotary tool and comprises a protruding section protruding from the flat face; and in a friction stirring step, the flat surface is brought into contact with the first metal member and the second metal member, and a front end face of the protruding section is inserted deeper than an upper overlapping section to join an upper front butt section and the upper overlapping section.
METHOD AND APPARATUS FOR WELDING AN ALUMINUM ALLOY
The concepts described herein provide a method, system, and apparatus for joining, via welding, first and second members fabricated from an aluminum alloy including aluminum, zinc, and manganese, such as 7000-series aluminum alloys, and a resultant workpiece. A junction is formed by a first member being disposed contiguously to a second member. A welding machine generates a weld pool at the junction that includes liquified aluminum alloy. An ultrasonic transducer directs ultrasonic energy in proximity to the weld pool. In some embodiments, an electro-magnetic transducer directs electro-magnetic energy in proximity to the weld pool. The first member is fused to the second member at the junction upon solidification of the weld pool.
Laser assisted metallization process for solar cell stringing
Metallization of semiconductor substrates using a laser beam, and the resulting structures, e.g., micro-electronic devices, semiconductor substrates and/or solar cells, solar cell circuit, solar cell strings, and solar cell arrays are described. A solar cell string can include a plurality of solar cells. The plurality of solar cells can include a substrate and a plurality of semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality semiconductor regions. Each conductive contact structure includes a locally deposited metal portion disposed in contact with a corresponding one of the semiconductor regions.