The application relates to a low-silver solder for welding an electric vacuum device and a preparation method thereof, The low-silver solder for welding the electric vacuum device is characterized by consisting of Ag, Cu, Ni and a trace element R, wherein the low-silver solder comprises the following components in percentage by mass: 65-71% of Ag, 0-0.1% of Ni, 0-0.1% of trace element R and the balance of Cu; the trace element R consists of one or more of P, Sc, Be, Zr and La. A method of producing the low silver solder, characterized by the steps of: Ag, Cu except from copper foil and Ni are evenly preset in a smelting crucible, the trace elements wrapped by the copper foil are placed above main raw materials consisting of the Ag,Cu except from copper foil and Ni, then smelting and casting are carried out by adopting a vacuum induction smelting furnace, the vacuum degree of a furnace body reaches 10.sup.−1 Pa during smelting and casting, and finally a strip material or a wire materialis prepared by a post treatment process, which has the advantages of good processing performance, good fluidity, low air content in a welding line and excellent thermal stability.

A laser welding method is usable to weld a material containing copper as a main component. The laser welding method includes heating the material by irradiation with a first laser light and welding the material by irradiation of a portion, which has been irradiated with the first laser light, of the material with a second laser light with which an energy absorption rate of the copper contained in the material increases by an increase in a temperature of the material. A wavelength of the first laser light is 400 nm to 470 nm.

The present disclosure provides a battery protection circuit board and a preparation method thereof. The battery protection circuit board includes a first battery protection board and a second battery protection board, a hardness of the first battery protection board being greater than a hardness of the second battery protection board. The soldering method includes: preparing a first to-be-soldered region of the first battery protection board and preparing a second to-be-soldered region of the second battery protection board; preparing a first copper paste in the first to-be-soldered region of the first battery protection board and preparing a second copper paste in the second to-be-soldered region of the second battery protection board; and bonding the first to-be-soldered region of the first battery protection board and the second to-be-soldered region of the second battery protection board by the first copper paste and the second copper paste.

A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.

A solder bump forming member including: a base substrate having a plurality of recesses; and solder particles in the recesses, in which the solder particle has an average particle diameter of 1 to 35 μm and a C.V. value of 20% or less, and a part of the solder particle projects from the recess, or in cross-sectional view, when a depth of the recess is designated as H.sub.1, and a height of the solder particle is designated as H.sub.2, H.sub.1<H.sub.2 is established.

According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active material provided area A1 in which an electrode active material layer 24 is provided on a surface of the electrode core 22 and including a core exposed area A2 in which the electrode active material layer 24 is not provided and the electrode core 22 is exposed, and an active material provided area cutting step for cutting the active material provided area A1 by a pulse laser, and a core exposed area cutting step for cutting the core exposed area A2 by the pulse laser. Then, in the case where the pulse width (ns) of the pulse laser is represented by X and the lap rate (%) is represented by Y for the core exposed area cutting step, a condition represented by Y≥−3log X+106 is satisfied. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

An ultrasonic joining horn disclosed herein can generate ultrasonic vibration in a predetermined vibration direction and includes a base portion, a stand portion that rises from an upper surface of the base portion, and a pressure contact portion formed of a plurality of protrusions that protrude from an upper surface of the stand portion. Each of the protrusions is formed into a pyramid shape or a truncated pyramid shape, the protrusions are arrayed, and when viewed from top, at least a portion of a peripheral edge of a portion in which the protrusions are arrayed has a zigzag shape. The zigzag portion is formed along at least one of the vibration direction and a perpendicular direction to the vibration direction. The upper surface of the base portion has an exposed surface on which the stand portion is not formed.

In a method for manufacturing an energy storage device by applying welding to a container of the energy storage device, the method includes: arranging a jig on which wall surfaces are formed between two parts to be welded to which welding is applied; and welding the two parts to be welded while supplying a shield gas to the two parts to be welded from two different directions corresponding to the two parts to be welded.

A method includes forming one or more vias in a first layer, forming one or more vias in at least a second layer different than the first layer, aligning at least a first via in the first layer with at least a second via in the second layer, and bonding the first layer to the second layer by filling the first via and the second via with solder material using injection molded soldering.

A method and associated device for joining a battery cell tab to a plurality of foils associated with a plurality of electrodes of a battery cell are described. This includes arranging the plurality of foils in a stack, and joining, via a first joining device, the plurality of foils, wherein the first joining device defines a joining region. A portion of the battery cell tab is arranged on the plurality of foils, and joined, via a second joining device, to the plurality of foils. The second joining device generates a weld joint that is encompassed within the joining region defined by the first joining device. In doing so, weld quality and strength of internal welds in a battery cell may be improved by reducing the occurrence of porosities and cracks in the foil/tab weld joints.