Patent classifications
B23K26/048
Apparatus for laser ablation analysis
Apparatus for laser induced ablation spectroscopy (LIBS) is disclosed. An apparatus can have a computer, a pulsed laser and a lightguide fiber bundle that is subdivided into branches. One branch can convey a first portion of the light to a first optical spectrometer and a different branch can convey a second portion of the light to another optical spectrometer. The first spectrometer can be relatively wideband to analyze a relative wide spectral segment and the other spectrometer can be high dispersion to measure minor concentrations. The apparatus can have a plurality of spectrometers with distinct and/or complementary capabilities, and can include an inductively coupled plasma mass spectrometer and data and instructions in tangible media operable to obtain a synergistic composition analysis based on optical spectra and ion mass to charge ratio peaks from the mass spectrometer.
Laser Containment Structure for a Laser Printhead
A laser printhead assembly for a laser printhead is disclosed herein. The laser printhead assembly may include a laser containment door; and a laser containment housing that is configured to form a sealed enclosure with a label support of a label. The sealed enclosure may be configured to include the label and the laser printhead. The laser containment door, in a laser-enabled position, may be configured to permit the laser printhead, via a light beam, to modify the label and the laser containment door, in a laserdisabled position, may be configured to prevent a light beam from escaping the laser containment housing.
MANUAL LASER CLEANING DEVICE
A manual laser cleaning device for removing foreign matter present on the surface of a workpiece according to an embodiment includes a laser generator oscillating a laser beam, a controller controlling the laser generator, and a laser cleaning head receiving the laser beam emitted from the laser generator through an optical fiber and irradiating a surface of a workpiece with the received laser beam. The laser cleaning head includes a head housing having a handle, a collimator placed in the head housing and collimating the laser beam scattered at one end of the optical fiber into parallel light, a high-speed Galvano scanner scanning the laser beam transmitted through the collimator at high speed using a mirror mounted on a scanning motor, and a focal lens focusing the laser beam scanned by the high-speed Galvano scanner at a focal distance and irradiating the surface of the workpiece with the laser beam.
LASER SOLDERING SYSTEM AND LIGHT SHAPING METHOD THEREOF
A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.
Laser machining device and laser machining method
A unit vector calculating unit of a laser machining device obtains a unit vector based on respective current rotational positions of an A-axis and a B-axis. A movement command calculating unit, a speed command calculating unit, or a torque command calculating unit generates a command signal for maintaining a gap amount at a constant value, based on the unit vector, and the gap amount between a machining nozzle and a workpiece. With a servo control unit, on the basis of the command signal, an X-axis motor, a Y-axis motor, and a Z-axis motor are controlled, whereby the machining nozzle is moved relatively in three-dimensional directions with respect to the workpiece.
Laser processing apparatus
A laser processing apparatus includes a laser light output section, a first scanner and a second scanner, a distance measurement light emitting section, a reference member which is arranged at a position which is the other end of a correction optical path formed with the distance measurement light emitting section as one end of the correction optical path and is arranged such that an optical path length of the correction optical path is a predetermined reference distance, a distance measurement light receiving section which receives distance measurement light reflected by the workpiece or the reference member, a distance measuring section which measures a distance to the workpiece or the reference member, and a distance correcting section which compares a measurement result of the distance to the reference member with the reference distance stored in advance to correct the measurement result obtained by the distance measuring section.
METHOD AND SYSTEM FOR DETERMINING AND CONTROLLING THE SEPARATION DISTANCE BETWEEN A WORKING HEAD OF A LASER PROCESSING MACHINE AND THE SURFACE OF AN OBJECT BEING PROCESSED BY MEANS OF LOW COHERENCE OPTICAL INTERFEROMETRY TECHNIQUES
A method for determining a separation distance between a working head in a machine for laser processing a material and a surface of the material includes generating a measurement beam of low coherence optical radiation, leading the measurement beam towards the material and a reflected or diffused measurement beam towards an optical interferometric sensor arrangement in a first direction of incidence, generating a reference beam of low coherence optical radiation, leading the reference beam towards the optical interferometric sensor arrangement in a second direction of incidence superimposing the measurement and reference beams on a common region of incidence, detecting a position of a pattern of interference fringes between the measurement and reference beams on the common region of incidence, and determining a difference in optical length between the measurement and reference optical paths based on the position of the pattern of interference fringes along an illumination axis.
LASER AUTOMATIC FOCUSING EQUIPMENT FOR LASER ENGRAVING MACHINE
A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.
Measuring device for determining a distance between a laser processing head and a workpiece, laser processing system including the same and method for determining a distance between a laser processing head and a workpiece
A measuring device determines a distance between a processing head for a laser processing system configured to process a workpiece with a laser beam and the workpiece. The measuring device includes an optical coherence tomograph to measure a distance between the processing head and workpiece. In the optical coherence tomograph, measuring light generated by a measuring light source and reflected by the workpiece interferes with measuring light reflected in a reference arm with two or more reference stages. The stages include a first reference stage configured such that the measuring light reflected therein travels a first optical path length, and a second reference stage configured such that the measuring light reflected therein travels a second optical path length different from the first length, wherein the measuring light reflected by the workpiece interferes with reflected measuring light of the first reference stage and reflected measuring light of the second reference stage.
Method for the Thermal Processing of a Workpiece with a Thermal Processing Machine
A method for thermal processing of a workpiece uses a thermal processing machine. The method includes the following steps carried out in an automated manner: setting up the processing machine by producing contact between the processing tool and the workpiece and recording the spatial position of a workpiece surface, positioning the processing tool at a predetermined first and second distance from the workpiece surface and recording the associated signal values of the distance sensor as first and second measured values, and calibrating the distance controller which includes determining a height derivative of the distance sensor signal and an amplification factor for the signal of the distance sensor taking in account the first measured value, the second measured value, the first distance and the second distance; positioning the processing tool at a predetermined working distance from the workpiece surface with the inclusion of the amplification factor; and thermally processing the workpiece.