A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

A laser processing device and a laser processing method are provided. The laser processing device includes: at least two lasers each configured to generate a laser beam; focusing members corresponding to the at least two lasers respectively and configured to adjust focus positions of at least two laser beams generated by the at least two lasers; and a beam combination member configured to receive the at least two laser beams whose focus positions have been adjusted, and output the at least two laser beams coaxially.

An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

A welding method includes performing welding by emitting laser light moving in a sweeping direction relatively to a processing object onto a surface of the processing object to melt a portion of the processing object onto which the laser light is emitted, wherein the laser light includes: first laser light having a wavelength equal to or larger than 800 nm and equal to or smaller than 1200 nm; and second laser light having a wavelength equal to or smaller than 550 nm.

Laser device (100) includes first and second laser oscillators (1), (2) that respectively emit first and second laser lights (LB1), (LB2) having first and second wavelengths, and first and second optical systems (10), (20). First optical system (10) is configured to couple first and second laser lights (LB1), (LB2) to transmit the first and second laser lights to second optical system (20), and second optical system (20) is configured to condense first laser light (LB1) at first condensing position (FP1) and second laser light (LB2) at second condensing position (FP2). A maximum angle formed by an optical axis and an outermost component of first laser light (LB1) emitted from first optical system (10) is different from a maximum angle formed by an optical axis and an outermost component of the second laser light (LB2).

A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first processing step as a perforation laser, with which a perforation (12) is produced in the glass element (2) along an intended cutting line (8), whereby the processing laser (4) is operated in a second processing step with a modified laser beam (14) as a separating laser, with which a splitting of the filaments (6) forming the perforation (12) is effected.

A welding or cladding apparatus in which one or more energy beam emitters are used to generate a wide beam spot transverse to a welding or cladding path, and one or more wide feeders feed wire to the spot to create a wide welding or cladding puddle.

A method for drilling holes in a part includes positioning the part relative to a laser source, applying a first stress to the part, and applying a laser from the laser source to the part to drill a hole therein, wherein the first stress which is present during the application of the laser counteracts a second stress induced by the application of the laser.

For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.