A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.

A device for generating a laser line on a work plane includes a first laser light source configured to generate a first raw laser beam, a second laser light source configured to generate a second raw laser beam, and an optical arrangement configured to reshape the first raw laser beam to form a first illumination beam with a first caustic and a first beam profile, and reshape the second raw laser beam to form a second illumination beam with a second caustic and a second beam profile. The first illumination beam and the second illumination beam are directed with overlap on the work plane and define a joint illumination direction. The first beam profile and the second beam profile jointly form the laser line on the work plane. The optical arrangement is configured to position the first caustic and the second caustic offset from one another in the illumination direction.

An optical arrangement converts a laser beam into a line-type beam having a line-type beam cross-section that extends along a line direction with a non-vanishing intensity. The arrangement has: reshaping optics having: an input aperture through which the laser beam is radiated in; and an elongate output aperture, the reshaping optics being configured such that the laser beam radiated in is converted into a beam packet with beam segments that emerge through the output aperture; homogenization optics, which contribute to the conversion of the beam packet into the line-type output beam, and by which different beam segments are mixed and superposed along the line direction; and redirection optics configured to redirect the laser beam such that an incidence position/direction of laser beam on the input aperture is changed in dependence on time.

An optical arrangement is provided for converting an input laser beam into a linear output beam propagating along a propagation direction and having in a working plane and a linear beam cross section extending along a line direction and having a non-vanishing intensity. The optical arrangement includes a reshaping optical unit having an input aperture for receiving the input laser beam and an output aperture, and is configured to convert the input laser bean into a beam packet having a multiplicity of beam segments that emerges through the output aperture. In addition, a homogenization optical unit is included having a first lens array and a second lens array arranged downstream of the first lens array in the beam path, the homogenization optical unit configured to mix different beam segments of the beam packet along the line direction. A transformation lens is configured such to superpose the mixed beam segments so as to form the linear output beam, and a displacement device is configured to displace the second lens array relative to the first lens array.

Methods and apparatuses for additive manufacturing are described. A method for additive manufacturing may include exposing a layer of material on a build surface to one or more projections of laser energy including at least one line laser having a substantially linear shape. The intensity of the line laser may be modulated so as to cause fusion of the layer of material according to a desired pattern as the one or more projections of laser energy are scanned across the build surface.

The disclosure provides a control device of an annealing device, which is capable of further suppressing a temperature of a surface opposite to a laser irradiation surface from rising. A beam spot of a pulsed laser beam output from a laser light source on a surface of an annealed target is shaped into a long shape in one direction by a beam shaping optical element. A movement mechanism moves the beam spot with respect to the annealed target. The control device controls the laser light source and the movement mechanism and performs annealing by performing a sweep operation of moving the beam spot in a longitudinal direction of the beam spot with respect to the annealed target while causing the pulsed laser beam to be incident on the annealed target.

An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.

An optical arrangement converts an input laser beam into a line-like output beam, which propagates along a propagation direction and which has, in a working plane, a line-like beam cross section extending along a line direction. The optical system includes: a reshaping optical unit having an input aperture, through which the input laser beam is radiated, and an elongate output aperture, elongatedly extending along an aperture longitudinal direction, the reshaping optical unit converting the input laser beam radiated through the input aperture into a beam packet exiting through the output aperture; and a homogenization optical unit which converts the beam packet into the line-like output beam, different beam segments of the beam packet being intermixed and superimposed along the line direction. The aperture longitudinal direction extends in a manner rotated about the propagation direction by a non-vanishing angle of rotation with respect to the line direction.