A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

The technology disclosed relates to high utilization of donor material in a writing process using Laser-Induced Forward Transfer. Specifically, the technology relates to reusing, or recycling, unused donor material by recoating target substrates with donor material after a writing process is performed with the target substrate. Further, the technology relates to target substrates including a pattern of discrete separated dots to be individually ejected from the target substrate using LIFT.

An optical device includes a plurality of laser light sources, an output module having an optical modulator, and a time divider that is disposed between the plurality of laser light sources and the output module and that is configured to divide laser beams emitted from the plurality of laser light sources in time.

A pattern forming apparatus for a base material includes a holding unit and a pattern forming unit. The holding unit is configured to hold a base material on which one of a protrusion shape portion and a recess shape portion is formed. The pattern forming unit is configured to form a pattern on the base material. The pattern is formed on at least one of the protrusion shape portion, the recess shape portion, a periphery of the recess shape portion, a periphery of the protrusion shape portion, a portion along the protrusion shape portion, and a portion along the recess shape portion.

Provided are a laser annealing apparatus and a method of manufacturing a substrate having a poly-Si layer using the laser annealing apparatus. The laser annealing apparatus includes a laser beam source that emits a linearly polarized laser beam, a polygon mirror that rotates around a rotation axis and reflects the laser beam emitted from the laser beam source, a first Kerr cell disposed on a laser beam path between the laser beam source and the polygon mirror, and a first optical element that directs the laser beam reflected by the polygon mirror toward an amorphous Si layer where the laser beam is irradiated upon the amorphous Si layer.

To form linear grooves of desired groove width on a metal strip surface and provide a grain-oriented electrical steel sheet having excellent magnetic properties, a linear groove formation method comprises: forming a resist coating on at least one surface of a metal strip; thereafter irradiating the resist coating with a laser while scanning the laser in a direction crossing a rolling direction of the metal strip, to remove the resist coating in a part irradiated with the laser; and thereafter performing etching treatment to form a linear groove in a part of the metal strip in which the resist coating is removed, wherein the resist coating contains a predetermined amount of an inorganic compound, and on the surface of the metal strip, the laser has a predetermined elliptic beam shape.

Disclosed is a method for an all-laser hybrid additive manufacturing. After a matrix is obtained by means of selective laser melting forming, a subtractive forming is carried out on the matrix by means of a pulse laser to form a cavity, and the cavity is then packaged to obtain a forming material with an internal cavity structure. A laser precision packaging method is used in the method based on the melting of the laser selective region. Also disclosed is the apparatus, comprising a laser unit (2), a control unit (4) and a forming unit (6). The laser unit is in light path connection with the forming unit, and the control unit is electrically connected with the laser unit and the forming unit respectively. The laser unit comprises a first laser light source to and a second laser light source. The forming unit comprises a welding unit (68), and the welding unit is controlled by the control unit and is matched with the laser unit for the additive manufacturing.

A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.

A laser processing apparatus includes two chuck tables for holding workpieces on their holding surfaces, an X-axis feed unit for moving the chuck tables which are being arrayed in an X-axis direction, a laser beam applying unit for applying a laser beam to the workpiece on one at a time of the chuck tables to process the workpiece, and a pair of delivery areas arrayed in the X-axis direction on both sides of the laser beam applying unit, for delivering workpieces to and from the chuck tables. The laser beam applying unit includes a laser oscillator, a beam condenser, and a laser beam scanning unit for displacing a position where the laser beam is applied to the holding surface of the one of the chuck tables.

A processing method of a workpiece used when the workpiece is processed is provided. The processing method of a workpiece includes a disposing step of disposing the workpiece in a gas containing a substance that generates an active species that reacts with the workpiece, a measurement step of measuring the distribution of the thickness of the workpiece disposed in the gas, and a laser beam irradiation step of irradiating the workpiece in the gas with a laser beam of which the power is adjusted based on the distribution of the thickness measured in the measurement step. In the laser beam irradiation step, the removal amount by which a region irradiated with the laser beam in the workpiece is removed by the active species is controlled by irradiating the workpiece with the laser beam of which the power is adjusted.