Patent classifications
B23K26/0884
AUTOMATED LSP PROCESS EQUIPMENT SYSTEM FOR AERO-ENGINE BLADE
An automated laser shock peening (LSP) process equipment system for an aero-engine blade, including: a base, where a loading and unloading manipulator, working manipulator, reverse engineering mechanism, coating apparatus, and LSP apparatus are disposed; the loading and unloading manipulator is configured to grab a blade and place it on the reverse engineering mechanism, which includes a reverse engineering instrument and controller that are connected, the instrument can generate three-dimensional digital data of the blade, and the controller generates a working path for coating and LSP according to the data, and transmits the path to the working manipulator; the loading and unloading manipulator places the blade into the pallet, and the working manipulator drives the blade to a corresponding position according to the path. Independent locating and clamping systems of the pallet and the blade and the pallet and the manipulator fix a position of the blade relative to the manipulator.
Transparent Coating Removal Through Laser Ablation
A system includes a robotic arm, a rotisserie control linkage, and a computer system. The robotic arm includes a touch probe and laser head. The rotisserie control linkage is configured to couple to a transport cart. The computer system is communicatively coupled to the robotic arm and the rotisserie control linkage and is configured to control the system to probe, using the touch probe of the robotic arm, a transparent outer layer of an aircraft canopy located on the transport cart in order to determine surface measurements of the aircraft canopy. The computer system also controls the system to ablate, using a plurality of predetermined parameters and the laser head of the robotic arm, an interface layer located between the transparent outer layer and the aircraft canopy, wherein movements of the robotic arm during the ablation are based on the surface measurements.
NUMERICAL CONTROL DEVICE AND METHOD FOR CONTROLLING ADDITIVE MANUFACTURING APPARATUS
An NC device as a numerical control device controls an additive manufacturing apparatus for producing an object by layering, on a workpiece, a material melted by being irradiated with a beam. The NC device includes: a feature quantity extracting unit that extracts, from image data, a feature quantity for determining a welding state that is a state where a molten material is added to the workpiece; and a process map creating unit that creates a process map in which a shape of the object and a layering condition are associated with each other. The layering condition is selected from among a plurality of layering conditions on the basis of a result of determination of the welding state, and includes at least one of beam intensity and a supply amount of a material.
System and Method for Laser Cleaning
A laser cleaning system includes a laser cleaning device having a laser rubber-removal assembly having a laser generator, a laser ejector connected with the laser generator, and a position adjustor slidably connected with a loading assembly; and a recycling assembly having a vacuum collector communicated with a recycling processing device; wherein the laser ejector is arranged on the loading assembly through the position adjustor; wherein the laser generator is configured to generate laser beams to remove rubber residues and the position adjustor is configured to adjust locations of the laser ejector; wherein the vacuum collector is configured to collect the rubber residues and the recycling processing device is configured to granulate the collected rubber residues.
Ultrafast laser inscribed structures for signal concentration in focal plan arrays
The present invention relates to ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays, as well as methods of making and/or using ultrafast laser inscribed structures for signal concentration in focal plan arrays, focal plan arrays, imaging and/or sensing apparatuses comprising said focal plan arrays. Such ultrafast laser inscribed structures are particularly adapted to condense broad band radiation, thus allowing increased sensing efficiencies to be obtained from imaging and/or sensing apparatuses. Such ultrafast laser inscribed structures can be efficiently produced by the processes provided herein.
Laser Processing Robot System for Performing Laser Processing Using Robot
A laser processing robot system, in which an augmented reality processing technology is used to enable a processing laser beam and its irradiation position to be safely and easily seen, is provided. A laser processing robot system includes an image processing device having an augmented reality image processing unit for performing augmented reality image processing for an actual image including an image of a robot captured by an imaging device. The augmented reality image processing unit is adapted to superimpose a virtual image representing at least one of a laser beam obtained by assuming that the laser beam is emitted from a laser irradiation device to a workpiece, and an irradiation position of the laser beam, onto the actual image, and to display the superimposed image on the display device.
LASER WELDING OF OVERLAPPING METAL WORKPIECES ASSISTED BY VARYING LASER BEAM PARAMETERS
A method of laser welding a workpiece stack-up that includes at least two overlapping metal workpieces is disclosed. The method includes advancing a beam spot of a laser beam relative to a top surface of the workpiece stack-up and along a beam travel pattern to form a laser weld joint, which is comprised of resolodified composite metal workpiece material, that fusion welds the metal workpieces together. And, while the beam spot is being advanced along the beam travel pattern, between a first point and a second point, which may or may not encompass the entire beam travel pattern, at least one of the following laser beam parameters is repeatedly varied: (1) the power level of the laser beam; (2) the travel speed of the laser beam; or (3) the focal position of the laser beam relative to the top surface of the workpiece stack-up.
Machine Tool Having Cable Guide Apparatus
The invention relates to a cable guide apparatus, wherein the cable guide apparatus comprises: a guide apparatus, a slide which is movably guided in the guide apparatus, a deflection roller which is connected to the slide, a first tension weight, a cable pull apparatus which connects the first tension weight to the slide guided in the guide apparatus, wherein the connection cable has a free end and a fixed end connected to a connection apparatus and extends over the deflection roller, a second tension weight and a second guide apparatus in which the tension weights are each movably guided, such that the connection cable extending over the deflection roller is preloaded in a first displacement region of the free end by a force generated by the weight force of the first tension weight and is preloaded in a second displacement region of the free end by a force generated by a total of the weight forces of the tension weights.
Methods and systems for joining at least two workpieces
The disclosure relates to methods and systems for joining at least two workpieces, including forming a weld joint by moving a machining beam, e.g., a laser beam, and the at least two workpieces relative to one another along a feed direction, wherein the movement of the machining beam and the two workpieces relative to one another is superimposed with a periodic movement in a movement path, e.g., a two-dimensional movement path, which extends in a transverse direction perpendicularly to the feed direction and, e.g., additionally in the feed direction. The movement path has, between two reversal points in the transverse direction, at least one stop point at which a speed component of the periodic movement in the transverse direction is zero. The invention also relates to computer program products and systems for carrying out the methods.
Method for workpiece processing and cutter manufacturing using a laser
A laser cutting method includes a step of determining a material to be removed and dividing the material to be removed into a plurality of material chips so as thereby to organize a machining plan for laser cutting; and, a step of, according to the machining plan for laser cutting, moving a laser along a boundary defining the material to be removed on the workpiece to perform cutting in a first direction and a second direction, such that the material chips can be separated from the workpiece orderly piece by piece so as to form a specific pattern. While in laser cutting, the method removes the material piece by piece. With the laser to remove the material chips through cutting along the boundary, the pattern on the workpiece is thus finished equivalently by the laser. Thereupon, the machining time can be significantly reduced.