A spatial filter is made by forming a structure comprising a focusing element and an opaque surface, the opaque surface being disposed remotely from the focusing element in substantially the same plane as a focal plane of the focusing element; and by forming a pinhole in the opaque surface at or adjacent to a focal point of the focusing element by transmitting a substantially collimated laser beam through the focusing element so that a point optimally corresponding to the focal point is identified on the opaque surface and imperfection of the focusing element, if any, is reflected on the shape and position of the pinhole so formed.

A spatial filter is made by forming a structure comprising a focusing element and an opaque surface, the opaque surface being disposed remotely from the focusing element in substantially the same plane as a focal plane of the focusing element; and by forming a pinhole in the opaque surface at or adjacent to a focal point of the focusing element by transmitting a substantially collimated laser beam through the focusing element so that a point optimally corresponding to the focal point is identified on the opaque surface and imperfection of the focusing element, if any, is reflected on the shape and position of the pinhole so formed.

A method for producing a plurality of holes in a curved surface, wherein the individual holes are removed layer by layer, the first layers to be removed of the holes being arranged at different distances in a Z-direction of the laser, the holes each being processed in a specific focal position, wherein only the holes detected from the same focal position are processed.

A method for producing a plurality of holes in a curved surface, wherein the individual holes are removed layer by layer, the first layers to be removed of the holes being arranged at different distances in a Z-direction of the laser, the holes each being processed in a specific focal position, wherein only the holes detected from the same focal position are processed.

A laser hole drilling system. The system includes a laser source that generates a laser beam along an optical axis, a cylindrical lens along the optical axis downstream of the laser source, and a spherical lens downstream of the cylindrical lens, the spherical lens offset from the optical axis to provide an anamorphic optical train to generate an asymmetric teardrop shaped energy distribution at a focal plane.

A laser hole drilling system. The system includes a laser source that generates a laser beam along an optical axis, a cylindrical lens along the optical axis downstream of the laser source, and a spherical lens downstream of the cylindrical lens, the spherical lens offset from the optical axis to provide an anamorphic optical train to generate an asymmetric teardrop shaped energy distribution at a focal plane.

A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

An apparatus and method of fabricating particles composed of metals, conducting polymers, semiconductors, and composites of such materials are provided. The method includes application of an editing tool, such as a laser, for patterning an editable structure that mounted on an electrically conductive substrate. Portions of the editable structure may be removed so as to allow electrodeposition.

The problem to be solved by the present invention is to provide a novel technique that can remove a strained layer introduced into an aluminum nitride substrate. In order to solve this problem, the present aluminum nitride substrate manufacturing method involves a strained layer removal step for removing a strained layer in an aluminum nitride substrate by heat treatment of the aluminum nitride substrate in a nitrogen atmosphere. In this way, the present invention can remove a strained layer that has been introduced into an aluminum nitride substrate.

A composite panel having a plurality of carbon plies, a perforated metallic foil comprising several apertures and being directly secured to the plurality of carbon plies, and a protective layer made from resin reinforced with fibers which is secured to the metallic foil. The perforated metallic foil is embedded in the protective layer through its apertures. A free surface of the protective layer forms a top side of the composite panel. The thickness of the protective layer between the top side of the composite panel and the perforated metallic foil is at least 15 micrometers and the perforated metallic foil has a thickness of not more than 30 micrometers. The plurality of apertures in the aggregate defines an open area of not more than 40% of the surface area and a maximum distance between two opposed points in a perimeter of an aperture is equal to or less than 3 mm.