A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate. A meter section of a cooling aperture is formed in the substrate. An internal coating is applied onto a surface of the meter section. An external coating is applied over the substrate. A diffuser section of the cooling aperture is formed in the external coating and the substrate to provide the cooling aperture.

A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate. A meter section of a cooling aperture is formed in the substrate. An internal coating is applied onto a surface of the meter section. An external coating is applied over the substrate. A diffuser section of the cooling aperture is formed in the external coating and the substrate to provide the cooling aperture.

A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit controls light intensities of at least two irradiation points included in the plurality of irradiation points independently of each other.

Systems, devices, and techniques for creating blind annular vias for metallized vias are described. For example, a vortex beam may be applied to an optically transmissive substrate, where the vortex beam may modify a portion of the substrate in an annular shape. The annular shape may extend from a surface of the substrate to a depth that is less than a thickness of the substrate, and the annular shape may have an annular width (e.g., a ring width) that is the same for various diameters of the annular shape. A blind annular via may be formed by etching the modified portion of the substrate, where the blind annular via may include a pillar comprising the same material as the surrounding substrate. In addition, a metallized annular via may be created by filling the blind annular via with a conductive material, and removing a portion of the substrate opposite the surface.

Systems, devices, and techniques for creating blind annular vias for metallized vias are described. For example, a vortex beam may be applied to an optically transmissive substrate, where the vortex beam may modify a portion of the substrate in an annular shape. The annular shape may extend from a surface of the substrate to a depth that is less than a thickness of the substrate, and the annular shape may have an annular width (e.g., a ring width) that is the same for various diameters of the annular shape. A blind annular via may be formed by etching the modified portion of the substrate, where the blind annular via may include a pillar comprising the same material as the surrounding substrate. In addition, a metallized annular via may be created by filling the blind annular via with a conductive material, and removing a portion of the substrate opposite the surface.

A laser processing apparatus includes a spatial light modulator for inputting laser light output from a laser light source and outputting laser light after phase modulation by a hologram, and a control unit for presenting, on the spatial light modulator, the hologram for focusing the laser light after the phase modulation output from the spatial light modulator on a plurality of irradiation points in a processing object by a focusing optical system. The control unit sets at least one of a shape and a size of a processing region defined by the irradiation points in a first plane intersecting an optical axis of the laser light and a processing region defined by the irradiation points in a second plane intersecting the optical axis and separated from the first plane in a direction of the optical axis to be different from each other.

Methods and products formed thereby that include depositing a light-absorbing particle on a substrate and irradiating the particle with a pulsed laser beam to cause an increase in local temperature of a portion of the substrate contacted by and adjacent to the particle, enabling the particle to penetrate and migrate through the substrate to form a pore. The methods may include additional steps of applying a magnetic field gradient to the particle as the particle is irradiated with the laser beam in order to promote the movement of the particle within the substrate or to direct the movement of the particle within the substrate, and/or the step of filling the pore with a material that provides a functional capability independent of the properties of the substrate.

Methods and products formed thereby that include depositing a light-absorbing particle on a substrate and irradiating the particle with a pulsed laser beam to cause an increase in local temperature of a portion of the substrate contacted by and adjacent to the particle, enabling the particle to penetrate and migrate through the substrate to form a pore. The methods may include additional steps of applying a magnetic field gradient to the particle as the particle is irradiated with the laser beam in order to promote the movement of the particle within the substrate or to direct the movement of the particle within the substrate, and/or the step of filling the pore with a material that provides a functional capability independent of the properties of the substrate.

A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.