A method of separating a transparent mother sheet includes contacting a first surface of the transparent mother sheet with an open ended pressure assembly including a pressure vessel shell, thereby forming a shell cavity defined by the first surface of the transparent mother sheet and the pressure vessel shell, where the transparent mother sheet comprises a damage path. The method also includes removing gas from the shell cavity through a fluid removal outlet extending through the pressure vessel shell to reduce a cavity pressure in the shell cavity, thereby applying stress to the damage path to separate a portion of the transparent mother sheet along the damage path.

A laser cutting apparatus includes a lower jig configured to support a lower portion of a first side of a cutting region of an object to be cut by a laser beam, an upper jig configured to support an upper portion of the first side of the cutting region of the object, a laser nozzle configured to emit the laser beam towards the cutting region of the object, and a spatter block jig locatable between a body part of the object and the cutting region of the object.

Proposed is a method of processing micro-holes formed in an upper mold used for adsorbing, transferring, and laminating a thin structure. The micro-holes drilled by setting n mono-layers in a thickness direction of the upper mold, applying the femtosecond pulsed laser beam onto a second mono-layer in a given pattern, processing the micro-holes at a thickness of the next mono-layer in a 2D manner, and sequentially applying the femtosecond pulsed laser beam to the mono-layers while lowering a focus of the laser in units of 1 /n. The femtosecond pulsed laser beam is applied along inner surfaces of the micro-holes, thereby adjusting a dimension of a diameter of each of the micro-holes to be processed, and improving surface roughness of each of the inner surfaces of the micro-holes. Surroundings of an inlet-side edge are chamfered or rounded to prevent generation of the burrs and damage to the thin film sheet.

A laser processing method includes a first step of irradiating a surface of a composite material with a laser to form a hole processing groove on the composite material by scanning first paths from an outside corresponding to an inner peripheral surface side of a through hole to be formed to an inside corresponding to a center side of the through hole to be formed, the first paths extending across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole by scanning second paths from the outside to the inside after the first step, the second paths extending across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

A laser processing machine including: a laser source that emits a laser beam; a polarization rotator unit; a beam rotator unit; a lens; and a controller, which apply the laser beam to a workpiece, the polarization rotator unit includes a wave plate and first actuator that rotates the wave plate, the beam rotator unit includes an optical system that adjusts an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the lens at a position eccentric from a central axis, a second actuator rotates the optical system, the lens condenses the laser beam on the workpiece, the controller controls a rotational speed ratio between the first actuator and the second actuator, and adjusts a polarized state of the laser beam by controlling the rotational speed ratio.

A laser processing machine including: a laser source that emits a laser beam; a polarization rotator unit; a beam rotator unit; a lens; and a controller, which apply the laser beam to a workpiece, the polarization rotator unit includes a wave plate and first actuator that rotates the wave plate, the beam rotator unit includes an optical system that adjusts an irradiation angle of the laser beam to the workpiece by making an incident laser beam eccentric to output and making the laser beam incident on the lens at a position eccentric from a central axis, a second actuator rotates the optical system, the lens condenses the laser beam on the workpiece, the controller controls a rotational speed ratio between the first actuator and the second actuator, and adjusts a polarized state of the laser beam by controlling the rotational speed ratio.

A laser head apparatus that enables switching between a laser beam and a purging stream. The laser head apparatus includes a bracket that provides for translation and rotation of the laser optics and purging nozzle. The laser optics and purging nozzle are located on opposite sides of the bracket and may be rotated to different rotational positions around a center axis of the bracket and translated to different linear positions along a length of the bracket. Methods of removing material using the laser head apparatus to between a laser beam and a purging stream are also provided.

Machining device comprising an optical trepanation head (1), comprising an opto-mechanical system having a head body (21) provided with a rotating device (22), a picosecond or femtosecond pulsed laser source (3), and at least one optical fiber (4) wherein the rotation device (22) of the opto-mechanical system (2) comprises a rotative diffraction grating (R1). Machining process by means of optical trepanation using such a device.

Machining device comprising an optical trepanation head (1), comprising an opto-mechanical system having a head body (21) provided with a rotating device (22), a picosecond or femtosecond pulsed laser source (3), and at least one optical fiber (4) wherein the rotation device (22) of the opto-mechanical system (2) comprises a rotative diffraction grating (R1). Machining process by means of optical trepanation using such a device.

The invention relates to a method of forming a void with a circular cross section in a substrate, more particularly to forming through holes electronic substrates The method comprising the steps of causing a laser cutter to traverse in an arc to an intended circumference of the void, traversing the intended circumference of the void at least once, wherein the lead in from the arc to the circumference comprises a radius.