A system includes a robotic arm, a rotisserie control linkage, and a computer system. The robotic arm includes a touch probe and laser head. The rotisserie control linkage is configured to couple to a transport cart. The computer system is communicatively coupled to the robotic arm and the rotisserie control linkage and is configured to control the system to probe, using the touch probe of the robotic arm, a transparent outer layer of an aircraft canopy located on the transport cart in order to determine surface measurements of the aircraft canopy. The computer system also controls the system to ablate, using a plurality of predetermined parameters and the laser head of the robotic arm, an interface layer located between the transparent outer layer and the aircraft canopy, wherein movements of the robotic arm during the ablation are based on the surface measurements.

An optical axis adjusting method includes a position detecting step of emitting a laser beam from a laser oscillator, applying the laser beam to a processing point, and detecting the position of the laser beam by using a position detecting unit set at the processing point, a storing step of storing the position of the laser beam as detected in the position detecting step as a reference position, and an adjusting step of operating an adjusting mechanism of each optical component holder in the case that the position of the laser beam is deviated from the reference position after performing maintenance of each optical component, thereby adjusting the position of the laser beam so that the position of the laser beam is shifted back to the reference position.

An optical axis adjusting method includes a position detecting step of emitting a laser beam from a laser oscillator, applying the laser beam to a processing point, and detecting the position of the laser beam by using a position detecting unit set at the processing point, a storing step of storing the position of the laser beam as detected in the position detecting step as a reference position, and an adjusting step of operating an adjusting mechanism of each optical component holder in the case that the position of the laser beam is deviated from the reference position after performing maintenance of each optical component, thereby adjusting the position of the laser beam so that the position of the laser beam is shifted back to the reference position.

A method measures an edge of a workpiece by scanning. The scanning is performed by a scanning tool mounted on a moving head of an edge-facing machine while that moving head is moved along the edge to be measured before, during or after an edge facing tool of the edge-facing machine that faces the edge. The method can be performed by an edge-facing machine that includes at least one edge facing tool and that further includes a scanning tool mounted on a movable head of the machine, which head is movable along an edge of a workpiece.

A device for generating a laser line on a work plane includes a first laser light source configured to generate a first raw laser beam, a second laser light source configured to generate a second raw laser beam, and an optical arrangement configured to reshape the first raw laser beam to form a first illumination beam with a first caustic and a first beam profile, and reshape the second raw laser beam to form a second illumination beam with a second caustic and a second beam profile. The first illumination beam and the second illumination beam are directed with overlap on the work plane and define a joint illumination direction. The first beam profile and the second beam profile jointly form the laser line on the work plane. The optical arrangement is configured to position the first caustic and the second caustic offset from one another in the illumination direction.

A workpiece processing method includes holding a workpiece unit on a holding table and forming a division start point. The workpiece unit has a workpiece having a front side and a back side, and an additional member formed on the back side of the workpiece. The additional member is different in material from the workpiece. The workpiece unit is held on the holding table with the additional member opposed to the holding table. The division start point is formed by applying a laser beam to the front side of the workpiece with the focal point of the laser beam set inside the workpiece. The laser beam forms a modified layer inside the workpiece and simultaneously forming a division start point inside the additional member due to the leakage of the laser beam from the focal point toward the back side of the workpiece.

A workpiece processing method includes holding a workpiece unit on a holding table and forming a division start point. The workpiece unit has a workpiece having a front side and a back side, and an additional member formed on the back side of the workpiece. The additional member is different in material from the workpiece. The workpiece unit is held on the holding table with the additional member opposed to the holding table. The division start point is formed by applying a laser beam to the front side of the workpiece with the focal point of the laser beam set inside the workpiece. The laser beam forms a modified layer inside the workpiece and simultaneously forming a division start point inside the additional member due to the leakage of the laser beam from the focal point toward the back side of the workpiece.

A device configured for a laser treatment, including a support and objects, each attached to the support via a region absorbing for the laser, the support comprising a system for optically guiding (42, 44, 50, 52) the laser towards at least a plurality of said absorbing regions.

A device configured for a laser treatment, including a support and objects, each attached to the support via a region absorbing for the laser, the support comprising a system for optically guiding (42, 44, 50, 52) the laser towards at least a plurality of said absorbing regions.

A substrate processing method of transcribing, in a combined substrate in which a first substrate and a second substrate are bonded to each other, a device layer formed on a surface of the second substrate to the first substrate is provided. A laser beam is radiated in a pulse shape from a rear surface side of the second substrate to a laser absorption layer formed between the second substrate and the device layer.