Patent classifications
B23K3/0307
SOLDERING IRON DEVICE
A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.
Soldering iron device
A soldering iron device includes a main body, where an end portion of the main body is provided with a tip, a heating core for heating the tip is provided in the main body, and a measuring element is provided in the main body; and the measuring element includes a mounting rod and a sensor, the sensor is provided on an end portion of the mounting rod, a measuring cavity is formed in the tip, the sensor is inserted into the measuring cavity, and the mounting rod extends toward a direction away from the tip. Compared with the prior art, since the sensor is not provided in the heating core, but is directly inserted into the tip, the present disclosure overcomes the heat transfer distance between the heating core and the tip and directly measures the temperature of the tip, which is highly accurate in measurement and strongly practicable.
Computer chassis welding device
A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.
Method for manufacturing shunt resistor
In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.
Method for manufacturing shunt resistor
A method for manufacturing a shunt resistor is described. In this method, a first electrode plate and a second electrode plate are provided. The first electrode plate includes a first carrying portion having a first hole. The second electrode plate includes a second carrying portion having a second hole. A resistor plate is placed between the first and second electrode plates. The resistor plate has a first through hole and a second through hole respectively on the first hole and the second hole. A first rivet is pressed into the first through hole and the first hole. A second rivet is pressed into the second through hole and the second hole. Current is applied to the first rivet and the second rivet to weld the first rivet, the first electrode plate and the resistor plate, and to weld the second rivet, the second electrode plate and the resistor plate.
COMPUTER CHASSIS WELDING DEVICE
A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.
Soldering iron tip
The present invention provides a soldering iron with a tip having two separate halves that are electrically isolated from one another. When both halves of the tip are applied to an electrically conductive material, such as the material to be soldered, an electrical circuit between the tip halves and an electrical power source is completed. Therefore, the tip can reach operating temperatures quickly. When the tip is removed from the joint, the electrical circuit is broken and the tip material may quickly cool to a temperature safe for human contact. The tip material permits higher power outputs than other battery operated portable soldering irons and heat and cools faster the conventional soldering tips.
SOLDERING IRON TIP
The present invention provides a soldering iron with a tip having two separate halves that are electrically isolated from one another. When both halves of the tip are applied to an electrically conductive material, such as the material to be soldered, an electrical circuit between the tip halves and an electrical power source is completed. Therefore, the tip can reach operating temperatures quickly. When the tip is removed from the joint, the electrical circuit is broken and the tip material may quickly cool to a temperature safe for human contact. The tip material permits higher power outputs than other battery operated portable soldering irons and heat and cools faster the conventional soldering tips.
METHOD FOR MANUFACTURING SHUNT RESISTOR
A method for manufacturing a shunt resistor is described. In this method, a first electrode plate and a second electrode plate are provided. The first electrode plate includes a first carrying portion having a first hole. The second electrode plate includes a second carrying portion having a second hole. A resistor plate is placed between the first and second electrode plates. The resistor plate has a first through hole and a second through hole respectively on the first hole and the second hole. A first rivet is pressed into the first through hole and the first hole. A second rivet is pressed into the second through hole and the second hole. Current is applied to the first rivet and the second rivet to weld the first rivet, the first electrode plate and the resistor plate, and to weld the second rivet, the second electrode plate and the resistor plate.
METHOD FOR MANUFACTURING SHUNT RESISTOR
In a method for manufacturing a shunt resistor, a resistor plate with a first side surface and a second side surface opposite to each other is provided. A first electrode plate and a second electrode plate are respectively pressed onto the first side surface and the second side surface, thereby forming a first connection surface between the first electrode plate and the resistor plate, and a second connection surface between the second electrode plate and the resistor plate. A first conductive module is placed on opposite ends of the first connection surface, and a second conductive module is placed on opposite ends of the second connection surface. Current is applied to the first and second connection surfaces via the first and second conductive modules respectively to weld the first electrode plate and the resistor plate, and to weld the second electrode plate and the resistor plate.