Described herein is an aluminium alloy multi-layered brazing sheet product for brazing in an inert-gas atmosphere without a flux, comprising a core layer made of a 3xxx alloy comprising 0.20-0.75 wt. % Mg, and provided with a covering clad layer comprising 2-5 wt. % Si on one or both sides of said 3xxx alloy core layer and a Al—Si brazing clad layer comprising 7-13 wt. % Si positioned between the 3xxx alloy core layer and the covering clad layer, wherein the covering clad layer has a thickness X.sub.1 and the Al—Si brazing clad layer has a thickness X.sub.2 and wherein X.sub.2≥2X.sub.1. The invention further relates to the use of an aluminium alloy multi-layered brazing sheet product in a fluxfree controlled atmosphere brazing (CAB) operation to produce a heat exchanger apparatus.

A method of connecting two CMC substrates that includes providing two substrates; placing one substrate approximate to the other substrate, such that at least a portion of the two substrates overlap and define a brazing area; placing a brazing material approximate the brazing area; defining a primary raster pattern that encompasses the brazing area and a portion of the two substrates outside the brazing area; defining a secondary raster pattern that encompasses the brazing area; allowing a laser to scan the primary raster pattern to preheat the brazing area to a temperature below the brazing material's melting point; allowing the laser to scan the secondary raster pattern to heat the brazing area to a temperature that is above the brazing material's melting point; melting and allowing the brazing material to flow within the brazing area; and cooling the brazing area to form a brazed joint connecting the two substrates.

A nickel-based brazing foil with a composition consisting essentially of 11 atom %<Cr≤16 atom %, 0 atom %≤Mo≤3.5 atom %, 4 atom %≤B≤5.5 atom %, 11 atom %≤Si≤16 atom %, 0 atom %≤P≤0.5 atom %, 0 atom %≤C≤0.85 atom %, 0 atom %≤Fe≤5 atom %, 0 atom %≤Co≤5 atom %, 0 atom %≤Cu≤2 atom %, 0 atom %≤V≤2 atom %, 0 atom %≤Nb≤2 atom %, incidental impurities of ≤1.0 wt. % and the rest Ni, is provided.

A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.

A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.

To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

The invention relates to a method for producing a metal-ceramic substrate and to a furnace suitable for carrying out the method. With the method, a metal-ceramic substrate with increased thermal and current conductivity can be obtained. The method comprises the steps of providing a stack containing a ceramic body, a metal foil, and a solder material in contact with the ceramic body and the metal foil, the solder material comprising a metal having a melting point of at least 700° C., a metal having a melting point of less than 700° C., and an active metal, and heating the stack, the stack passing through a heating zone for heating.

A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 μm or more and 700 μm or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.

A preferable aspect of the present invention provides a hot-rolled steel sheet with excellent low-temperature toughness, a steel pipe using the same, and a manufacturing method therefor, wherein the hot-rolled steel sheet contains, by weight, 0.35-0.65% C, 0.01-0.4% Si, 13-26% Mn, 0.01-0.3% Ti, 0.01% or less B, 4% or less Al, 1-6% Cr, 0.05% or less P, 0.02% or less S, 0.01% or less N, 0.01-2% Cu, 0.001-0.015% Nb, and the balance Fe and other unavoidable impurities, the alloy elements satisfying the following relational formulas—[Relational formula 1] 70<[10*(C/12)+(Mn/55)+(Al/27)]*100<95 and [Relational formula 2] 4<100*(Cr/52+100*(Nb/93))<9; wherein a microstructure comprises, by area fraction, 97% or more (including 100%) of austenite and 3% or less (including 0%) of a carbide, the crystal grain size of the austenite being 18-30 μm or less; and wherein the size of the carbide is 0.5 μm or less.

Ni—Mn—Si based braze filler alloys or metals which may be nickel-rich, manganese-rich, or silicon-rich braze filler alloys, have unexpectedly narrow melting temperature ranges, low solidus and low liquidus temperatures, as determined by Differential Scanning calorimetry (DSC), while exhibiting good wetting, and spreading, without deleterious significant boride formation into the base metal, and can be brazed at lower temperatures. The nickel rich alloys contain 58 wt % to 70 wt % nickel, the manganese-rich alloys contain 55 wt % to 62 wt % manganese, and the silicon-rich alloys contain 25 wt % to 29 wt % silicon. Copper with or without boron to partly replace nickel may be employed without any substantial increase of the melting point, or to reduce the melting point. The braze filler alloys have sufficient brazability to withstand high temperature conditions for thin-walled aeronautical and other heat exchangers.