A butt joint deep penetration laser welding method is used for joining facing end sections of flat steel products, each having a carbon content CS<0.02%. In order to improve such a method such that an improved weld quality in terms of geometry and strength is achievable with it, at least one carbon-containing carrier material is inserted into a butt joint gap between the end sections, the carbon content of which is C.sub.T≥20.Math.C.sub.S, preferably C.sub.T≥100.Math.C.sub.S, and/or carbon is inserted into the butt joint gap or applied to at least one end section, such that the volume of the carbon inserted into the butt joint gap corresponds to 1% to 20% of the volume of a melt produced by a butt joint deep penetration laser welding process.

A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.

A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

Systems and methods for low-manganese welding alloys are disclosed. An example arc welding consumable may comprise: less than 0.4 wt % manganese; strengthening agents selected from the group consisting of nickel, cobalt, copper, carbon, molybdenum, chromium, vanadium, silicon, and boron; and grain control agents selected from the group consisting of niobium, tantalum, titanium, zirconium, and boron. The grain control agents may comprise greater than 0.06 wt % and less than 0.6 wt % of the welding consumable. The resulting weld deposit may comprise a tensile strength greater than or equal to 70 ksi, a yield strength greater than or equal to 58 ksi, a ductility (as measured by percent elongation) of at least 22%, and a Charpy V-notch toughness greater than or equal to 20 ft-lbs at −20° F. The welding consumable may provide a manganese fume generation rate less than 0.01 grams per minute during the arc welding operation.

Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by mass, 1.0 to 7.0% of In, 1.5 to 5.5% of Bi, 1.0 to 4.0% of Ag, 0.01 to 0.2% of Ni, and 0.01 to 0.15% of Sb, with the remainder made up by Sn.

Multi-part abrasive tools are disclosed herein. In one embodiment, an abrasive tool includes a first body, a second body, and a braze layer that couples the first body to the second body. The braze layer includes a braze alloy having a liquidus temperature and insoluble particles at least partially surrounded by the braze alloy. The insoluble particles are insoluble with the braze alloy at temperatures at least 100° C. above the liquidus temperature of the braze alloy.

The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component. The techniques may also include inserting a solid retainer material into the joint region through an aperture in one of the first component or the second component to form a mechanical interlock between the first component and the second component and sealing the aperture to retain the solid retainer material within the joint region. The solid retainer material includes at least one of a metal, a metal alloy, or a ceramic.

A lead-free soldering foil, for connecting metal and/or metal-coated components. allows the setting of a defined connecting-zone geometry and, with pores and/or voids being formed only to a minimal extent, achieves a high-temperature-resistant soldered connection that ensures great reliability even in staged soldering processes and increases the thermal conductivity of the connecting zone. The lead-free soldering foil is constructed so that, in a soft-solder matrix, two or more composite wires are each individually sandwiched by roll cladding between two soft-solder strips, parallel to one another and parallel to the edges of the strips. These composite wires include a core, which contains a higher-melting, stronger metal/metal alloy in comparison with the soft-solder matrix and around which a shell of another metal/metal alloy is arranged, and, after the roll-cladding operation, there is still 5 pm to 15 pm of soft-solder material arranged above and below at least one of the cores.

A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.

A field device for processing and automation technology includes a first and a second component that can each be mechanically connected at a joining surface by means of a joining point. Two metal surface layers are each applied at least to the joining surface of the first component and the joining surface of the second component. The metal of the surface layers is different from the metal of the first and/or the metal of the second component. A joining material is applied between the respective joining surfaces of the two components, wherein the joining material includes particles at least partially consisting of a metal that corresponds with the metal of the surface layers The joining of the two components occurs at a joining temperature below 300° C.