Patent classifications
B23K35/0272
Suppressors and their methods of manufacture
A suppressor having a body and a first connector half coupled to the body, wherein the first connector half includes a first component that includes at least one channel and a first surface; and wherein the body provides a second surface, wherein a gap between the first surface and the second surface defines at least one track; wherein the gun includes a second connector half comprising at least one protrusion, wherein the protrusion and channel have corresponding shapes that allow the protrusion to be inserted through the channel and into alignment with the track, wherein the first component may be rotated with respect to the protrusion and the body to bring the protrusion out of alignment with the channel so that the first and second surfaces clamp the protrusion to thereby secure the first connector half and second connector half with respect to each other.
WELDING ELECTRODE WITH FUNCTIONAL COATINGS
The disclosed technology generally relates welding electrodes, and more particularly to consumable welding electrodes having functional coatings. In one aspect, a welding electrode comprises a core wire having a base metal composition and two or more coatings covering at least a portion of the core wire. The two or more coatings comprise an electrically conductive coating including one or more electrically conducting elements or compounds in addition to or other than copper (Cu). The two or more coatings additionally comprises an additional functional coating including one or more additional elements or compounds adapted to modify a surface tension of a molten droplet formed from the welding electrode. In another aspect, a method of manufacturing a welding electrode comprises providing the core wire having the base metal composition and forming the two or more coating layers.
SOLID WIRE FOR ARC WELDING USE
An arc welding solid wire includes: a steel material; and a copper plating layer formed on a surface of the steel material, in which an amount of Cu in the steel material and the copper plating layer is 0.05 mass % to 0.30 mass % with respect to a total mass of the wire, a surface of the wire is coated with 0.05 g to 0.20 g of oil with respect to 1 kg of the wire, and on a surface of the copper plating layer, an arithmetic average roughness Rac in a circumferential direction is 0.25 .Math.m to 1.00 .Math.m, and an arithmetic average roughness Ral in a longitudinal direction is 0.07 .Math.m to 0.50 .Math.m.
BONDING WIRE FOR SEMICONDUCTOR DEVICE
The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at % with a balance being made up of Ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 μm in thickness.
CARBIDE-BASED HARDFACING
One aspect of the disclosure provides an iron-based hardfacing layer which includes hard or wear resistant phases resulting at least in part from dissolution of silicon and/or boron carbide particles into a liquid iron-based metal during the fabrication process. In an embodiment, the hardfacing layer is formed by a fusion welding process in which carbide particles are added to the molten weld pool. In an example, the filler metal supplied to the welding process is a mild steel. In an embodiment, the hardness as measured at the surface of the hardfacing ranges from 40 to 65 HRC. In an example, the iron-based hardfacing layer also includes tungsten carbide particles.
Welding electrode
An electrode (10) is presented including a sheath (14) formed of a ductile material, an outer coating (16) including a flux material, and a core (12) including at least one of flux material and alloying material. The ductile material may be an extrudable subset of elements of a desired superalloy material and the alloying material may include elements that complement the ductile material to form a desired superalloy material when the electrode is melted. The outer coating may be formed of a flexible bonding material or it may be segmented (18, 20) to facilitate bending the electrode onto a spool. Any hygroscopic material of the electrode may be included in the core to protect it from exposure to atmospheric moisture.
Coated wire
A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself consists of: (a) pure silver consisting of (a1) silver in an amount in the range of from 99.99 to 100 wt.-% and (a2) further components in a total amount of from 0 to 100 wt.-ppm or (b) doped silver consisting of (b1) silver in an amount in the range of from >99.49 to 99.997 wt.-%, (b2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm and (b3) further components in a total amount of from 0 to 100 wt.-ppm, or (c) a silver alloy consisting of (c1) silver in an amount in the range of from 89.99 to 99.5 wt.-%, (c2) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (c3) further components in a total amount of from 0 to 100 wt.-ppm, or (d) a doped silver alloy consisting of (d1) silver in an amount in the range of from >89.49 to 99.497 wt.-%, (d2) at least one doping element selected from the group consisting of calcium, nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount of from 30 to <5000 wt.-ppm, (d3) at least one alloying element selected from the group consisting of nickel, platinum, palladium, gold, copper, rhodium and ruthenium in a total amount in the range of from 0.5 to 10 wt.-% and (d4) further components in a total amount of from 0 to 100 wt.-ppm, wherein the at least one doping element (d2) is other than the at least one alloying element (d3), wherein the individual amount of any further component is less than 30 wt.-ppm, wherein the individual amount of any doping element is at least 30 wt.-ppm, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, and wherein the coating layer is a double-layer comprised of a 1 to 1000 nm inner layer of gold and an adjacent 0.5 to 100 nm thick outer layer of palladium or a double-layer comprised of a 0.5 to 100 nm thick inner layer of palladium and an adjacent >200 to 1000 nm thick outer layer of gold.
Metal cored welding wire that produces reduced manganese fumes and method
Various embodiments of a metal cored wires and methods are disclosed. In one embodiment of the present invention, a metal cored wire comprises a metal sheath and a metal-powder core material comprising manganese particles. The manganese particles are coated with a coating material to reduce the manganese fumes and exposure during welding.
Fabrication of high-entropy alloy wire and multi-principal element alloy wire
In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.
FLUX, FLUX-CORED SOLDER USING FLUX, FLUX- COATED SOLDER USING FLUX AND SOLDERING METHOD
A flux according to the present invention contains a rosin methyl ester in which the flux is a solid or solid-like flux at 25° C., and is used for an inside of a flux-cored solder or an exterior of a flux-coated solder.