A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

A method determines state information relating to a belt grinder. The belt grinder has at least one abrasive belt for grinding a workpiece. The method includes providing measurement data relating to the belt grinder, and determining the state information from the measurement data using a machine learning system. The machine learning system is configured to determine the state information based on the provided measurement data.

A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

Disclosed herein are an apparatus of manufacturing a panel for home appliance by performing uniform surface processing on the panel and a method of manufacturing a home appliance by performing uniform surface processing on a panel. The apparatus of manufacturing a panel for home appliance includes a contacting roller configured to perform surface-processing on a panel that is to be processed; a pressing roller configured to press the panel toward the contacting roller; and a supporting roller configured to support a center middle portion of the contacting roller.

Disclosed herein are an apparatus of manufacturing a panel for home appliance by performing uniform surface processing on the panel and a method of manufacturing a home appliance by performing uniform surface processing on a panel. The apparatus of manufacturing a panel for home appliance includes a contacting roller configured to perform surface-processing on a panel that is to be processed; a pressing roller configured to press the panel toward the contacting roller; and a supporting roller configured to support a center middle portion of the contacting roller.

This disclosure relates to a belt grinder includes frame and first grinding assembly. The first grinding assembly includes transmission roller set, grinding belt and adjusting assembly. The transmission roller set includes driving roller and driven roller. Both the driving roller and the driven roller are rotatably disposed on the frame. The grinding belt is installed over the driving roller and the driven roller. The adjusting assembly includes rotatable component and contact rollers. The rotatable component is rotatably disposed on the frame. Rotation axis of the rotatable component is parallel to rotation axis of the driving roller. The contact rollers are rotatably disposed on the rotatable component. Contact rollers are different in shape. The rotatable component is rotatable with respect to the frame so as to force one of the contact rollers to contact or to be separated from the grinding belt.

This disclosure relates to a belt grinder includes frame and first grinding assembly. The first grinding assembly includes transmission roller set, grinding belt and adjusting assembly. The transmission roller set includes driving roller and driven roller. Both the driving roller and the driven roller are rotatably disposed on the frame. The grinding belt is installed over the driving roller and the driven roller. The adjusting assembly includes rotatable component and contact rollers. The rotatable component is rotatably disposed on the frame. Rotation axis of the rotatable component is parallel to rotation axis of the driving roller. The contact rollers are rotatably disposed on the rotatable component. Contact rollers are different in shape. The rotatable component is rotatable with respect to the frame so as to force one of the contact rollers to contact or to be separated from the grinding belt.

A grinding device includes a drivable backing pad and a flexible grinding element held on the backing pad by suctioning and is provided with abrasive grains. The grinding device is designed such that the grinding element, in the form of a grinding belt, protrudes circumferentially with respect to the backing pad, the abrasive grains covering the entire area of the grinding element.