A polishing head having a simple construction and a compact size is disclosed. The polishing head includes: a polishing-tool pressing member for supporting a polishing tool; a movable shaft coupled to the polishing-tool pressing member; a housing which houses the movable shaft therein; and a diaphragm which forms a pressure chamber between an end portion of the movable shaft and the housing, the diaphragm including a central portion in contact with the end portion of the movable shaft, an inner wall portion connecting with the central portion and extending along a side surface of the movable shaft, a folded-back portion connecting with the inner wall portion and having a curved cross section, and an outer wall portion connecting with the folded-back portion and located outside the inner wall portion.

The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding method and to a sanding machine comprising: a carrier element (11), a plurality of pressure segments (12a, 12b, 12c) which can be actuated, in particular electromagnetically actuated, and which are disposed along the carrier element (11) and are each designed to press a sanding element, especially a sanding belt (21), against a workpiece (1), and at least one sensor (13a, 13b, 13c) for sensing a compressive force applied to a workpiece by one of the pressure segments.

The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding method and to a sanding machine comprising: a carrier element (11), a plurality of pressure segments (12a, 12b, 12c) which can be actuated, in particular electromagnetically actuated, and which are disposed along the carrier element (11) and are each designed to press a sanding element, especially a sanding belt (21), against a workpiece (1), and at least one sensor (13a, 13b, 13c) for sensing a compressive force applied to a workpiece by one of the pressure segments.

Loopback rolls which can transfer and guide a polishing tape (T) along a perimeter of a pressure contact roll (R) is provided, the pressure contact roll having a tapered peripheral edge having a top edge and a pair of slant edge faces formed on a periphery of the pressure contact roll, by which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism is switchably provided which pressure contacts each of bent portions of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge, to one tooth face (B1) or the other tooth face of a worm.

Loopback rolls which can transfer and guide a polishing tape (T) along a perimeter of a pressure contact roll (R) is provided, the pressure contact roll having a tapered peripheral edge having a top edge and a pair of slant edge faces formed on a periphery of the pressure contact roll, by which the polishing tape can be bent into a substantially V-shape in cross section, and a switchable pressure contact mechanism is switchably provided which pressure contacts each of bent portions of the polishing tape, which is bent into the substantially V-shape in cross section by the tapered peripheral edge, to one tooth face (B1) or the other tooth face of a worm.

A workpiece passes through a belt grinder for grinding and structuring a flat workpiece in a predefined direction of passage (P1) past at least one machining area of a structuring device. The structuring device comprises at least one endless grinding belt which is guided over deflection elements in at least one direction of circulation (P3) and the width of the which extends substantially across the working width of the belt grinder, and is guided over deflection elements, the longitudinal axes of which are oriented transversely to the direction of passage (P1) of the workpiece. Furthermore, the structuring device comprises an endless press-on belt 220 which is configured and arranged such that it exerts a force from the inside on the grinding belt in a press-on area, wherein the endless press-on belt is drivable with the aid of a drive unit. The direction of circulation (P2) of the press-on belt runs, at least in the press-on area, transversely to the direction of circulation (P3) of the grinding belt. The structuring device and the transport unit are configured and arranged such that the workpiece guided past the structuring device comes into contact with the machining area of the grinding belt. The structuring device comprises a control unit which controls the drive unit of the press-on belt such that the drive unit selectively drives the endless press-on belt in a first direction of circulation (P2) or in a second direction of circulation that is opposite to the first direction of circulation (P2).

A method of removing material from a workpiece includes moving a coated abrasive over a receiving surface of a platen, the receiving surface having at least one opening configured for the flow of an ejection material therethrough, moving the platen and workpiece relative to each other to contact the coated abrasive to the workpiece and removing material from the workpiece, and controlling a flow pressure for the ejection material through the at least one opening during removing material from the workpiece, where the flow pressure of the ejection material can be adjusted based on at least one of the operation parameters such as a translation rate of the coated abrasive over the receiving surface, the weight of the coated abrasive, a material removal rate, a coefficient of friction between the coated abrasive and the platen, or a combination thereof.

A method of removing material from a workpiece includes moving a coated abrasive over a receiving surface of a platen, the receiving surface having at least one opening configured for the flow of an ejection material therethrough, moving the platen and workpiece relative to each other to contact the coated abrasive to the workpiece and removing material from the workpiece, and controlling a flow pressure for the ejection material through the at least one opening during removing material from the workpiece, where the flow pressure of the ejection material can be adjusted based on at least one of the operation parameters such as a translation rate of the coated abrasive over the receiving surface, the weight of the coated abrasive, a material removal rate, a coefficient of friction between the coated abrasive and the platen, or a combination thereof.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.