A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality of endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

In certain embodiments, a system is provided for the efficient removal of an old grip from a fishing pole while maintaining the integrity of the pole. The system can include a removal portion including one or more rotational assemblies that rotate one or more grinding members. The grinding members can include a rotational blade with a centering rod. The rotational assembly can remove the old grip while maintaining the integrity of the rod within. The system can include multiple sets of grinding members that are organized for efficient identification or may include adjustable grinding members that can be configured for specific rods. The system can further include a guide to help identify particular grinding members for use with particular fishing poles.

An edge trimming method for cutting an outer peripheral portion of a workpiece having a chamfered part on the outer peripheral portion. The method includes a cut in step of relatively moving a rotating cutting blade and a chuck table to cause the blade to cut into the outer peripheral portion, a cutting step of, after the cut in step, rotating the chuck table and causing the outer peripheral portion to be cut, to form an annular step, and a moving step of, after the cutting step, moving the blade in a direction of its axis of rotation to form another annular step adjacent to the first-mentioned annular step. The cut in, cutting, and moving steps are repeated in this order, and a stepped oblique region is formed on the outer peripheral portion, with a thickness increasing from an outermost peripheral edge toward an inner side of the workpiece.

A wafer processing method includes a holding step of holding a wafer on a chuck table; a dressing step of cutting a peripheral marginal area of the wafer by a cutting blade mounted to a cutting unit to condition a state of a cutting edge; and a dividing step of cutting streets by the cutting blade mounted to the cutting unit to divide the wafer into individual device chips.

The present disclosure provides an automatic chuck apparatus comprising a mechanical chuck, a mechanical chuck mounting bracket, a hydraulic motor, a lifting mechanism, a chuck key and a lifting cylinder. The mechanical chuck is mounted above the mechanical chuck mounting bracket. The hydraulic motor, the lifting mechanism and the lifting cylinder are mounted below the mechanical chuck mounting bracket. The hydraulic motor is configured to control the rotation of the chuck key, the lifting cylinder is configured to drive the chuck key to ascend or descend through the lifting mechanism, thereby the mechanical chuck is locked or loosened by the chuck key. The present disclosure further provides a grinding wheel cutting apparatus and a cutting method. In the present disclosure, the locking of the chuck is automatically controlled, thereby improving the working efficiency and ensuring sufficient locking force of the chuck.

The present disclosure provides a grinding wheel apparatus comprising a grinding wheel, a flange, a pull rod and a spindle. The grinding wheel is mounted on one side of the flange, and the other side of the flange is a tapered bucket, the tapered bucket has a buckle slot. The pull rod passes through the spindle, and a pull rod head of the pull rod is fixed to one end of the spindle, the tapered bucket is inserted into the spindle from the other end of the spindle, and the buckle slot is engaged with the T-shaped buckle of the pull rod in the spindle to fix the flange on which the grinding wheel is mounted to the other end of the spindle. The present disclosure further provides a grinding wheel cutting apparatus comprising the grinding wheel apparatus, and a cutting method using the grinding wheel cutting apparatus.

The present disclosure provides a grinding wheel cutting apparatus comprising a first laser distance sensor, a master controller and a grinding wheel. The first laser distance sensor is communicatively coupled to the master controller. The laser distance sensor is configured to obtain an outer diameter of a rod workpiece. The master controller is configured to determine a segment length of a segment to be cut from the rod workpiece based on the outer diameter, a material density of the rod workpiece and a preset segment weight. The master controller is configured to perform a control to circularly cut the rod workpiece with the grinding wheel according to the segment length. The present disclosure further relates to a cutting method using the grinding wheel cutting apparatus.

A sintered magnet sawing apparatus is provided comprising a cylindrical work carrier mounted on a horizontal rotating spindle and having a regular polygonal shape in a perpendicular cross section, and a plurality endless elastic belts adapted to force a work of sintered magnet against the carrier surface to secure the work thereto and adapted to travel synchronously with and counter to the rotation of the carrier in a circulatory manner. In accordance with rotation of the carrier, the work is delivered to the peripheral surface of the carrier, secured thereto by the elastic belts, moved further forward and cutoff machined by an outer cutoff blade. The divided work is moved further forward, released and discharged from the carrier.

The invention relates to a disk-shaped cutting tool, to a radial cutting method for machining axially elongated workpieces, to a cutting device and to a use of a disk-shaped cutting tool. A disk-shaped cutting tool according to the invention has defined flexibility and a defined impact. In a radial cutting process according to the invention, lateral deflection of the axially stationary rotating tool brings the tool, by means of the at least one laterally applied grinding and polishing surface, into axial effective contact with the workpiece to be machined. In a cutting device according to the invention, the cutting tool can be moved only radially to machine the workpiece. A use according to the invention of a disk-shaped tool serves the purpose of specimen preparation and subsequent surface analysis on a workpiece cut to length.

Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).