The present disclosure relates to abrasive articles including an abrasive member having opposing major surfaces, a working surface and an exterior attachment surface, wherein the abrasive member comprises an inorganic material having a Mohs hardness greater than about 7.0; and a magnetic member, having opposing first and second major surfaces and a corresponding magnetic force, wherein the first major surface of the magnetic member faces the exterior attachment surface. The abrasive articles of the present disclosure may include a third member. The third member is attached to the magnetic member by a magnetic force. The abrasive member with attached magnetic member is designed to be easily removed from the third member. Methods of separating an abrasive member from an abrasive article and replacing the abrasive member of an abrasive article are also provided.

The present disclosure relates to abrasive articles including an abrasive member having opposing major surfaces, a working surface and an exterior attachment surface, wherein the abrasive member comprises an inorganic material having a Mohs hardness greater than about 7.0; and a magnetic member, having opposing first and second major surfaces and a corresponding magnetic force, wherein the first major surface of the magnetic member faces the exterior attachment surface. The abrasive articles of the present disclosure may include a third member. The third member is attached to the magnetic member by a magnetic force. The abrasive member with attached magnetic member is designed to be easily removed from the third member. Methods of separating an abrasive member from an abrasive article and replacing the abrasive member of an abrasive article are also provided.

Various embodiments of the present disclosure are directed towards a chemical mechanical polishing (CMP) system including a first CMP head and a second CMP head. The first CMP head is configured to retain a workpiece and comprises a first plurality of pressure elements disposed across a first pressure control plate. The second CMP head is configured to retain the workpiece. The second CMP head comprises a second plurality of pressure elements disposed across a second pressure control plate. A distribution of the first plurality of pressure elements across the first pressure control plate is different from a distribution of the second plurality of pressure elements across the second pressure control plate.

Various embodiments of the present disclosure are directed towards a chemical mechanical polishing (CMP) system including a first CMP head and a second CMP head. The first CMP head is configured to retain a workpiece and comprises a first plurality of pressure elements disposed across a first pressure control plate. The second CMP head is configured to retain the workpiece. The second CMP head comprises a second plurality of pressure elements disposed across a second pressure control plate. A distribution of the first plurality of pressure elements across the first pressure control plate is different from a distribution of the second plurality of pressure elements across the second pressure control plate.

A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing plate having at least one of a magnetic property, a color property, a structural property, or any combination thereof. The CMP pad conditioner assembly includes a plurality of segments including a ceramic substrate and a plurality of laser textured protrusions integral with the ceramic substrate. The plurality of laser textured protrusions is coated with a conformal diamond layer.

A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing plate having at least one of a magnetic property, a color property, a structural property, or any combination thereof. The CMP pad conditioner assembly includes a plurality of segments including a ceramic substrate and a plurality of laser textured protrusions integral with the ceramic substrate. The plurality of laser textured protrusions is coated with a conformal diamond layer.

The invention provides a polishing pad suitable for polishing at least one of semiconductor, optical, magnetic or electromechanical substrates. The pad includes a polyurea-containing polishing layer having a polyurea-containing matrix. The polyurea-containing matrix includes a soft phase formed from two or more aliphatic fluorine-free polymer groups capping two ends of at least one aliphatic fluorinated polymer group. The polyurea-containing matrix also includes a hard phase that contains a urea group formed from isocyanate group capping outer ends of the aliphatic fluorine-free polymer groups reacted with an amine-containing curative agent. Biuret crosslinking groups connect some of the soft segments to hard segments. The polishing layer is hydrophilic during polishing in shear conditions.

The invention provides a polishing pad suitable for polishing at least one of semiconductor, optical, magnetic or electromechanical substrates. The pad includes a polyurea-containing polishing layer having a polyurea-containing matrix. The polyurea-containing matrix includes a soft phase formed from two or more aliphatic fluorine-free polymer groups capping two ends of at least one aliphatic fluorinated polymer group. The polyurea-containing matrix also includes a hard phase that contains a urea group formed from isocyanate group capping outer ends of the aliphatic fluorine-free polymer groups reacted with an amine-containing curative agent. Biuret crosslinking groups connect some of the soft segments to hard segments. The polishing layer is hydrophilic during polishing in shear conditions.

The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.

The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.