A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.

The present disclosure relates to a grinding head (1) for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head (1) comprises a lower casing member (3), comprising a lower support (31) and an upwardly extending edge portion (32), and an upper casing number (2), comprising an upper cover (21) and a downwardly extending edge portion (22), wherein the upper casing member (2) is joinable to the lower casing member (3) by causing axially distal portions of the edge portions to bear on each other.

An end effector for a robotic sanding system includes a sanding head including a sander configured to sand a surface of a workpiece. A motor is operatively coupled to the sander. The motor is configured to rotate the sander to sand the surface of the workpiece. The motor includes a first central longitudinal axis. A coupler is configured to removably secure the end effector to an attachment interface of an arm of the robotic sanding system. The coupler includes a second central longitudinal axis. The first central longitudinal axis is offset from the second central longitudinal axis. One or more sensors are coupled to the sanding head. The one or more sensors are configured to detect presence of a metal within the predefined range.

The present invention relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the present invention relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head (10) includes an annular elastic member (40) configured to press a polishing tool (3) against the substrate (W), and a pressing-tool body (43) having a pressing surface (44) configured to press the polishing tool (3) against the substrate (W) via the elastic member (40), wherein the pressing surface (44) has a first fitting groove (45) in which a first portion (41) of the elastic member (40) fits, the first portion (41) protrudes from the pressing surface (44), the elastic member (40) is put on the pressing-tool body (43) with the elastic member (40) elastically deformed, and the polishing head (10) is configured to press the polishing tool (3) against the substrate (W) by the first portion (41).

A support assembly for supporting a surface treatment pad on a backing plate mounted on the spindle of a surface treatment tool includes a plurality of petal-shaped segments, each segment separated from an adjacent segment by a radially extending slit. The support assembly, which may be a unitary body printed from a single material using a 3-D printer may include three layers: a rear layer that rests against the backing plate, a front layer that rests against the surface treatment pad and includes the petal-shaped segments, and a compressible central layer interposed between the rear and front layers. The front layer may also include circumferentially extending grooves and ribs.

A sanding disc stabilizing structure of an orbital sander comprises a casing, a sanding power source, a sanding disc, and at least four springs. The sanding power source is assembled on the casing and comprises a drive shaft and a tool holder disposed on the drive shaft and offset from an axis of the drive shaft. The center of the sanding disc driven by the sanding power source to perform an orbital motion is disposed on the tool holder with a locking screw. Two ends of each of the at least four springs are respectively disposed on the casing and the sanding disc. The free length of each of at least four springs is greater than the spacing between an installation part of the casing and an installation part of the sanding disc provided for one of the at least four springs.

The present disclosure relates to a grinding head for a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a grinding head comprises a lower casing member, comprising a lower support and an upwardly extending edge portion, and an upper casing member, comprising an upper cover and a downwardly extending edge portion, wherein the upper casing member is joinable to the lower casing member by causing axially distal portions of the edge portions to bear on each other.

A method of manufacturing a window may include cutting a window having a uniform thickness of about 20 μm to about 100 μm and polishing a cut surface of the window with a polishing pad having an elastic modulus less than an elastic modulus of the window while applying slurry to the cut surface of the window.

The present application relates to a grinding machine for tungsten electrode, which includes a driving device and a grinding device arranged on a driving end of the driving device. The grinding device includes a mounting assembly and an adjusting assembly. The mounting assembly is mounted on the driving device, the driving end of the driving device passes through the mounting assembly, the mounting assembly is provided with a grinding chamber, a grinding plate is provided at the driving end of the driving device, and the grinding plate is positioned in the grinding chamber. The adjusting assembly is rotatably connected to the mounting assembly, the adjusting assembly is provided with a clamping component, and the adjusting assembly is configured to adjust a grinding angle of the tungsten electrode on the grinding plate.

The invention relates to a machine tool for robot-assisted surface finishing. According to one embodiment, the machine tool comprises a first support plate and a second support plate. The first support plate is designed for mounting on a manipulator. An output shaft for receiving a rotatable tool is mounted on the second support plate. The machine tool additionally comprises a linear actuator that acts between the first support plate and the second support plate, as well as a motor which is mounted on the first support plate. The machine tool additionally comprises a telescopic shaft with a first shaft portion and a second shaft portion that can be displaced relative to said first shaft portion. The first shaft portion is coupled to a motor shaft of the motor, and the second shaft portion as mounted on the second support plate. The telescopic shaft is coupled to the output shaft by means of a gear mechanism.