A ribbon supporting apparatus includes a support surface defining a first plane. The ribbon supporting apparatus includes a first wall portion extending along a surface edge of the support surface. The first wall portion includes a first surface defining a second plane that is offset from the first plane. The first wall portion includes a first hardness. The ribbon supporting apparatus includes a second wall portion extending along the surface edge and includes a second surface attached to the first surface and a third surface defining a third plane. The second plane extends between the first plane and the third plane. The second wall portion includes a second hardness that is greater than the first hardness. Methods of supporting a ribbon are also provided.

An automatic machine and an automatic method for grinding the edges of glass sheets are disclosed. The machine is provided with a machine body with motorized support and conveyance rollers or belts, an input conveyor with motorized support and conveyance rollers or belts, an output conveyor with motorized support and conveyance rollers and belts. There are at least two elements for conveying the glass sheets, a lower one and an upper one, which actuate respectively the synchronous motions about a lower axis and an upper axis, which engage and convey the glass sheets, which are interfaced alternately, for example the odd sheets with the lower conveyance elements and the even sheets with the upper conveyance.

A grinding apparatus includes a chuck table for holding a wafer, a grinding unit including, in a rotatable manner, a grinding wheel on which a plurality of grindstones for grinding the wafer held by the chuck table are disposed in an annular pattern, and a grinding water supply unit for supplying grinding water to the grindstones and the wafer. The chuck table includes a porous plate having a holding surface for holding the wafer under suction and a frame body that supports an outer periphery and a bottom surface of the porous plate and transmits a negative pressure and a positive pressure to the holding surface, and the frame body is formed with a plurality of grooves extending from the holding surface side to a side surface.

A method of grinding a surface of a workpiece that has surface irregularities includes a first grinding step of grinding the surface of the workpiece by a predetermined amount of stock removal while keeping a measuring element of a height gauge out of contact with the surface of the workpiece, thereafter, a height difference measuring step of bringing the measuring element of the height gauge into contact with the surface of the workpiece and measuring a height difference of surface irregularities on the surface of the workpiece with the height gauge, and a second grinding step of, if the measured height difference is larger than a preset range, grinding the surface of the workpiece while keeping the measuring element of the height gauge in contact with the surface of the workpiece until the measured height difference falls within the preset range.

The invention relates to a device for integrally processing a housing of a Computing, Communication, and Consumer (3C) product. The device includes a loading frame and an upper frame, where a material receiving device is arranged in the loading frame, a width of the loading frame is greater than that of the housing, a grinding device is arranged below the upper frame, and the grinding device includes a grinding movement device; the grinding movement device is connected to a grinding installation block, an outer side of the grinding installation block is provided with grinding lifting balls, a grinding arc block is embedded in an inner side of an upper portion of the grinding installation block, and the upper frame is provided with a material pressing device. An outer side of the loading frame is provided with a feeding and discharging device.

A method for grinding a silicon carbide wafer includes the following steps. Firstly, a single crystal is sliced into several wafers, in which each wafer has a silicon-side surface, which is the first surface. The opposite side is a carbon-side surface, which is the second surface. Subsequently, the silicon-side of the wafer is faced down and placed on a grinding stage for performing a first grinding process. It should be noted that a supporting structure exist between the wafer and the grinding stage. The supporting structure can have a concave or a convex framework. After grinding the carbon-side and removing the wafer from the stage, the wafer will appear convex or concave shape on the carbon-side surface. Thereafter, the wafer is flipped upside down and the carbon-side is placed on a flat stage without any supporting structure. Finally, the silicon-side is ground as a second grinding process.

In order to respond flexibly to various processing modes, such as forming curved surface shapes, when cutting a workpiece using a wire saw, this wire saw device (1) is provided with: a single robot arm (2) that is capable of moving freely by means of multi-axis control; a wire saw unit (3) that is detachably connected to the robot arm (2) via a tool changer (7); a wire (8) that spans a plurality of pulleys supported within the wire saw unit (3); and a workpiece cutting zone (20) that is established between the pulleys. The workpiece is cut to a prescribed shape by moving the robot arm (2) in a preset direction while running the wire (8) of the wire saw unit (3) and pressing the wire (8) against the supported workpiece.

A holding table manufacturing method includes forming a plurality of first grooves in a front surface of a plate-shaped body, forming a plurality of second grooves in a back surface of the plate-shaped body, laying, on one another, a plurality of the plate-shaped bodies formed respectively with a plurality of the first grooves and a plurality of the second grooves and uniting the plate-shaped bodies together to form a suction plate, and accommodating the suction plate in an accommodating recess of a frame body to form a holding table. The first grooves and the second grooves do not reach side surfaces of the plate-shaped body, the first grooves and the second grooves communicate with each other, and the thickness of the suction plate is larger than the depth of the accommodating recess.

A suction holding table for holding a holdable object under suction includes a base seat rotatable about a rotational axis, and a plurality of holders erected from the base seat and angularly spaced at equal angular intervals along a circle around the rotational axis, in which each of the holders has an upper surface functioning as a holding surface with a suction port defined therein, and attract the holdable object to the holder under a negative pressure applied via the suction port.

A grinding apparatus includes a chuck table for holding a workpiece thereon, a table base supporting the chuck table, a grinding unit for grinding the workpiece held on the chuck table with a grinding wheel mounted on an end of a spindle, a load detecting unit for detecting a load applied from the grinding unit to the table base, a tilt adjustment unit supporting the table base thereon, for adjusting a tilt of the table base, a storage for storing a correlative relation between loads applied to the table base and changes in the tilt of the table base, and a controller for controlling the tilt adjustment unit based on the load detected by the load detecting unit and the correlative relation, to adjust the tilt of the table base so that a change in the tilt of the table base that corresponds to the detected load is cancelled out.