The invention pertains in general to devices, systems and methods for removing vapor and heat generated during a restoration cycle in an optical disc restoration device.

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

A finishing device includes a finishing belt, a finishing belt holding device, a first drive configured to rotationally drive a workpiece about a workpiece axis, and a second drive configured to oscillate the workpiece and the finishing belt relative to another along the workpiece axis. The finishing belt holding device has a holding section configured to hold a portion of the finishing belt. The portion has an active area configured to finish a circumferential workpiece surface. The portion extends in a plane which is vertical when referring to the direction of gravity and extends in a horizontal direction when referring to the direction of gravity and when viewing in the running direction of the finishing belt. The finishing device includes a workpiece holding device defining a workpiece holding axis which is vertical when referring to the direction of gravity.

In a step of performing cylindrical grinding of a polycrystalline silicon bar 10 grown by a Siemens method, this cylindrical grinding step is performed such that a polycrystalline silicon rod 30, whose center axis C.sub.R is shifted from a center axis C.sub.0 of a silicon core wire 20 by 2 mm or more, is manufactured.

The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

A method for correcting non-rigid thin-walled tubular elements having geometric deficiencies, wherein, following correction, the tubular elements may perform over a wide range of pressure and temperatures, for example as a rocket motor beaker, from about −70 C to about 1000 C. Correction is required to remove asperities, maximize cylindricity, squaring a forward end wall and a rearward end wall, so that the forward end wall of the tube product may be fitted, bonded and sealed to a circular planar element using a labyrinth-joint closure. The method provides uniformity so that both the tubular elements and the circular planar elements are interchangeably uniform in size, shape and performance, and may be readily assembled into non-rigid thin-walled tube products.

In a step of performing cylindrical grinding of a polycrystalline silicon bar 10 grown by a Siemens method, this cylindrical grinding step is performed such that a polycrystalline silicon rod 30, whose center axis C.sub.R is shifted from a center axis C.sub.0 of a silicon core wire 20 by 2 mm or more, is manufactured.

A method for producing one or more bearing components along a production line, comprising honing the bearing components along the production line, cleaning the bearing components along the production line, grinding the bearing components along the production line, and transporting the bearing components along the production line utilizing one or more transport units.

A gettering layer forming apparatus configured to form a gettering layer on a substrate includes a substrate holder configured to hold the substrate; a wrapping film configured to be brought into contact with the substrate held by the substrate holder and polish the substrate; a base configured to support the wrapping film, and configured to be moved in a vertical direction and rotated around a vertical axis; and a water supply configured to supply water onto the substrate held by the substrate holder.

Apparatuses and associated methods for polishing side surfaces of fibers. The system includes a fiber loading mechanism for securing a fiber to the apparatus, a polishing mechanism, and a linear motion mechanism for linearly translating one of the polishing mechanism and the fiber for polishing a side surface of the fiber using the polishing mechanism.