An intelligent polishing system provides improvements to the polisher itself as well as networking capability enabling remote control and monitoring of multiple polishers. One or more electronic devices ensure that a user of the intelligent polisher operates the polisher to achieve optimum results. Such devices may include a polishing timer, a downward pressure sensor, or a tachometer to measure speed. The system may further include a memory for storing operational parameters or performance characteristics of the intelligent polisher for later downloading or retrieval. The same or a different memory may store calibration information to ensure that intelligent polisher operates within predetermined limits. Such operational parameters, performance characteristics or calibration information include RPM, polishing time, downward force or inlet air pressure. The system may further include a plurality of intelligent polishers, each in communication with a server enabling remote monitoring or control of the polishers through a computer or mobile device.

An intelligent polishing system provides improvements to the polisher itself as well as networking capability enabling remote control and monitoring of multiple polishers. One or more electronic devices ensure that a user of the intelligent polisher operates the polisher to achieve optimum results. Such devices may include a polishing timer, a downward pressure sensor, or a tachometer to measure speed. The system may further include a memory for storing operational parameters or performance characteristics of the intelligent polisher for later downloading or retrieval. The same or a different memory may store calibration information to ensure that intelligent polisher operates within predetermined limits. Such operational parameters, performance characteristics or calibration information include RPM, polishing time, downward force or inlet air pressure. The system may further include a plurality of intelligent polishers, each in communication with a server enabling remote monitoring or control of the polishers through a computer or mobile device.

A system for tracking workpiece movement during grinding of the workpiece includes a track, a motorized carriage movably mounted on the track, a detector, and a controller. A position of the carriage is determined by an encoder of the track. The detector is mounted on the carriage and includes a detection window and a sensor. The sensor detects a workpiece edge during grinding by detecting an image of the workpiece edge in the detection window. The controller determines a grinding position of the workpiece based on position data received from the carriage and edge data received from the detector. The controller controls the carriage to move in a forward direction or in a reverse direction to maintain the position of the image of the workpiece edge in the detection window.

The invention discloses a glass bottle mouth fine grinding device, which includes a working box and a working chamber located in the working box. A placing box is slidably arranged in the working chamber. The placing box is provided with a placing chamber. A glass bottle is slidably disposed in the placement cavity, and first cavities are symmetrically arranged on the left and right sides of the placement cavity. A circular clamping block is slidably disposed in the first cavity. The first cavity is connected by a first spring, and a second cavity is provided at the bottom of the placing box. A sliding block is slidably disposed in the second cavity, and the sliding block and the second cavity are connected by a second spring.

The invention discloses a glass bottle mouth fine grinding device, which includes a working box and a working chamber located in the working box. A placing box is slidably arranged in the working chamber. The placing box is provided with a placing chamber. A glass bottle is slidably disposed in the placement cavity, and first cavities are symmetrically arranged on the left and right sides of the placement cavity. A circular clamping block is slidably disposed in the first cavity. The first cavity is connected by a first spring, and a second cavity is provided at the bottom of the placing box. A sliding block is slidably disposed in the second cavity, and the sliding block and the second cavity are connected by a second spring.

The invention discloses a glass bottle mouth fine grinding device, which includes a working box and a working chamber located in the working box. A placing box is slidably arranged in the working chamber. The placing box is provided with a placing chamber. A glass bottle is slidably disposed in the placement cavity, and first cavities are symmetrically arranged on the left and right sides of the placement cavity. A circular clamping block is slidably disposed in the first cavity. The first cavity is connected by a first spring, and a second cavity is provided at the bottom of the placing box. A sliding block is slidably disposed in the second cavity, and the sliding block and the second cavity are connected by a second spring.

The invention discloses a glass bottle mouth fine grinding device, which includes a working box and a working chamber located in the working box. A placing box is slidably arranged in the working chamber. The placing box is provided with a placing chamber. A glass bottle is slidably disposed in the placement cavity, and first cavities are symmetrically arranged on the left and right sides of the placement cavity. A circular clamping block is slidably disposed in the first cavity. The first cavity is connected by a first spring, and a second cavity is provided at the bottom of the placing box. A sliding block is slidably disposed in the second cavity, and the sliding block and the second cavity are connected by a second spring.

A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

A grinding method, an OGS substrate and a manufacturing method of an OGS mother substrate are provided. The grinding method is used to grind the OGS substrate comprising a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.

An OGS substrate and a grinding method thereof are provided. The OGS substrate includes a base substrate, wherein a shielding pattern is formed inside a periphery region of the base substrate, a reference mark is formed above the shielding pattern, the grinding method comprises: grinding an edge of the base substrate to form a chamfer; identifying edges of the reference mark and the base substrate; calculating a position distance between an outer edge of the reference mark and the edge of the base substrate corresponding thereto based on the identified edges of the reference mark and the base substrate; judging whether the position distance is smaller than a first distance; if it is judged that the position distance is smaller than the first distance, stopping grinding; otherwise, continuing to grind.