A molding apparatus that injection molds an opening device on a packaging material sheet includes first and second molding units to injection mold a wall portion of the opening device on the sheet; the first molding unit comprising first and second molding elements configured to cooperate in contact to delimit at least part of a mold cavity fillable with molten material for forming a pull-member of the opening device; the mold cavity being delimited at least by first and second surfaces defined by the first and second molding elements respectively; a third molding unit cooperable with the first and second molding elements to delimit the mold cavity, and defining a third surface, facing the first and second surfaces and delimiting, together with these latter, the mold cavity; the third surface is shaped to be equidistant from the first and second surfaces when the first and second molding elements cooperate.

A filling device for the joint that provides filling of the desired area to be poured in cases where similar electrical transmission systems or components such as low and high voltage busbars and cables are attached to each other.

A packaging material comprising a core layer, an outermost layer arranged to face the exterior of a packaging container made of the packaging material, and an innermost layer arranged to face the interior of the packaging container is provided. The outermost layer and the innermost layer are laminated to the core layer. The laminated packaging material further comprises a locally distributed heat sealable material portion arranged on the innermost layer.

An injection molding method for a product with a connection elastic sheet, a loudspeaker and an electronic device are provided. The method comprises: providing a blank material comprising at least one connection piece and a material connection strip, and each connection piece comprising an elastic arm portion and a wire portion; positioning the blank material as an insert in a first injection mold by means of the material connection strip; injecting a first injection plastic part into the first injection cavity to obtain a first injection product; processing the first injection product for bending up the elastic arm portion toward an outer surface of the first injection plastic part; placing the processed first injection product into a second injection cavity of a second injection mold, and sealing the elastic arm portion; and injecting a second injection plastic part into the second injection cavity.

A molding system for applying moldable material to a pipe. An elongate mold has at least one elongate mold member movable relative another elongate mold member between open and closed positions. The mold includes a pipe support that extends generally radially into a mold cavity along a support axis. An inner end of the support is configured to support the pipe in a molding position in which an annular portion of the mold cavity extends circumferentially around the pipe. After moldable material in the annular portion of the mold cavity can support the pipe, the support is withdrawn from the mold cavity by moving outwardly along the support axis. An injector selectively dispenses additional moldable material into a space formed by the support in the existing moldable material.

A battery pack according to an embodiment of the present disclosure includes a plurality of battery cells, and a pack case in which the plurality of battery cells are accommodated, wherein the pack case includes a potting resin which covers all sides of the plurality of battery cells and is filled to a predetermined height between the plurality of battery cells.

A method of manufacturing an electronic component having a housing with terminals insert-molded thereon. Each of the terminals includes a tapered portion having a tapered width and an extension extending from the tapered portion. A mold defining a cavity includes an upper die and sliding dies. After positioning the extension in one of grooves formed in one surface of each of the sliding dies, sliding the sliding dies relative to the extension to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces of the tapered portion; and performing molding while keeping the upper die in close contact with the one surface, and keeping part of the tapered portion and the extension ying in the groove held between a bottom surface of the groove and the upper die with a remaining portion of the tapered portion lying in the cavity.

A mold for encapsulating a Pin-Fin type power module with resin is disclosed. The power module includes a DBC or IMS, power chips and multiple terminals provided on a first surface of the DBC or IMS and a Pin-Fin structure provided on a second surface of the DBC or IMS. The mold further includes: a cavity for containing the power module; multiple terminal protecting elements corresponding to the terminals, respectively, each for receiving at least a part of a terminal; and an injection hole provided on the bottom of the mold or on the side wall of the mold, The first surface faces the bottom of the mold and the injection hole is below the first surface when the power module is placed in the cavity. A method for manufacturing a power module is also provided.

The equipping of syringe barrels (11) with needles (25) takes place before the injection of the plastic, in which the needles (25) are introduced through the fixed part (5) of the injection mold (1) by a suitable transport device (transport rollers 33).

A method for manufacturing an interdental cleaner includes providing a rod-shaped carrier made of plastic, into which laterally protruding bristles are embedded. In this case, a filament array formed of a plurality of filament strands is inserted into a holding cassette and is fixed in a predefined alignment in the holding cassette by means of a holding device. The holding cassette is then inserted into an injection-molding device and the filament array is extrusion-coated with plastic in the injection-molding device, forming a plurality of rod-shaped carriers arranged spaced apart next to one another. Finally, the filament strands forming the filament array are separated at least in the sections located between adjacent rod-shaped carriers. In addition, a device for carrying out the method is provided.