A method for manufacturing a plastic part forming a human-machine control interface includes formation of a decorative film, formation of a technical film including a layer of haptic actuators and a layer of capacitive sensors, assembly to form an interface film, positioning in an injection mould, including an upper portion and a lower portion including a moveable support pad capable of coming into contact with the interface film such that a thickness is left free between the interface film and the lower portion of the injection mould outside of the support pad, injection of a plastic material into the free thickness on either side of the support pad, and opening of the injection mould and ejection of the plastic part formed.

An injection molding mold apparatus including: a first mold and a second mold forming a cavity into which thermoplastic resin is configured to be injected; a slide mold provided on at least one of the first and second molds, capable of moving back and forth in a direction intersecting a mold opening and closing direction, and forming a part of the cavity while being in pressure contact with an insert member during molding; and a pressing member provided at a portion where the slide mold is not provided among portions of the first and second molds that face each other and at a position corresponding to a tip end portion of the slide mold, being movable in the mold opening and closing direction, and pressing and moving the tip end portion in the mold opening and closing direction when the first and second molds are closed.

The present invention relates to a mould for encapsulating a carrier with electronic components, comprising: at least two mould parts, one of which with at least one mould cavity recessed into a contact side for enclosing electronic components placed on a carrier, and a feed channel for moulding material recessed into the contact surface of the mould part provided with the mould cavity. The invention also relates to a moulding apparatus, a method for at least partially encapsulating a carrier with electronic components and a carrier with electronic components encapsulated with moulding material.

A tool for overmoulding and/or backmoulding a curved glass body is proposed, the tool having a first surface for supporting the curved glass body. The tool comprises a plurality of pins, the pins each having a first end face at a first end of the pins, and at least one section of the first surface being formed by the first end faces of the pins. The pins are mounted to be displaceable in their longitudinal direction so that at least the section of the first surface can be adapted to a contour of the curved glass body.

A method of embedding opto-electronic components in a layer, wherein the components are disposed beside one another to be spaced apart on a carrier, including providing a molding tool having a bearing plate, wherein the bearing plate on a lower side includes resilient bearing regions, bringing the bearing plate by way of the resilient bearing regions to bear on upper sides of the components, filling an intermediate space between the components, the carrier, and the bearing plate with a molding material, curing the molding material to form the layer, and removing the molding tool from the layer and the embedded components.

A tool system for producing a workpiece by injection-molding includes: a tool part which has a cavity for shaping the workpiece from an injection-molding compound; and an adjusting device, which has a drive, a drive shaft, and a plurality of adjusting elements which are operatively connected to the drive shaft and are adjustable via the drive shaft. Driven by the drive, the adjusting elements, each with an actuating section for acting on at least one portion of the workpiece, are adjustable relative to the cavity.

A pressing member is configured to press a portion-to-be-pressed of a continuous-fiber sheet against a recessed surface of a first mold in a state where the continuous-fiber sheet is placed between the first mold and a second mold. A pulling member is configured to bring the continuous-fiber sheet into close contact with the main surface and the recessed surface by pulling a portion of the continuous-fiber sheet located on an outer peripheral side of the portion-to-be-pressed after the pressing member presses the portion-to-be-pressed against the recessed surface.

A spacer for maintaining one or more wires during a molding process, the spacer having an external frame, and a plurality of spring curved leaves. Each spring curved leaf has a fixed end attached to an inner face of the external frame and a free end. The free ends of the plurality of spring curved leaves are arranged to flexibly wrap the one or more wires.

A mould includes at least two mould parts, one of which includes a mould cavity for enclosing electronic components placed on a carrier and a contact surface for at least partially enclosing the mould cavity, contacting the carrier, and forming a tight connection with the carrier. A feed channel is recessed into the contact surface and the mould part further includes a displaceable barrier element that is displaceable in a direction substantially perpendicular to the contact surface connecting to the feed channel for regulating the size of a passage in the feed channel. A foil handler applies a foil layer between a wall of the feed channel and the displaceable barrier element which is configured for exerting a pressure onto the foil layer when the mould parts are moved apart to release the carrier with electronic components from the mould part.

A second mold is divided into a recess-side mold portion, which includes a recess, and a remaining mold portion in a sliding direction of a movable pin, while a size of a gap between the recess-side mold portion and the remaining mold portion is adjustable. The second mold is configured to execute a first-mold-closing operation for contacting the recess-side mold portion to the first mold and thereafter a second-mold-closing operation for contacting the remaining mold portion to the recess-side mold portion. A distal end portion of the movable pin is configured to be placed into a non-contacting state, in which the distal end portion of the movable pin is not in contact with the workpiece, at a time of executing the first-mold-closing operation. The distal end portion of the movable pin is configured to contact the portion of the workpiece at a time of executing the second-mold-closing operation.