The invention relates to a polymeric film for coating plastics mouldings with a coating material, the polymeric film comprising an adhesion-modified layer and also a layer of the coating material; where the polymeric film together with the adhesion-modified layer and the layer of the coating material is formable at room temperature; where the coating material wholly or partly covers the adhesion-modified layer; and where the adhesion-modified layer has a layer thickness of at least 0.1 μm; and where the adhesion-modified layer is in direct contact with the coating material. The invention further relates to uses of the polymeric film of the invention, to methods for its production and to methods for coating components using the polymeric film of the invention.

An insert molding component includes a primary molding section with a concave portion formed on one surface thereof, an insert component disposed on a bottom side of the concave portion of the primary molding section, a heat-insulating component disposed in the concave portion of the primary molding section and disposed on a top of the insert component, and a secondary molding section disposed in contact with the one surface of the primary molding section.

An objective of the present invention is to provide an organic glass laminate that exhibits excellent weathering resistance and abrasion resistance, and that can be used as an exterior member. This organic glass laminate comprises at least the following, in order: an organic glass base, a cured layer formed from the cured product of a resin composition, which comprises a curable resin and a UV absorber agent; and an inorganic oxide film. The glass transition temperature of the cured product which constitutes the cured layer is adjusted to 80-160° C., and the thickness of the inorganic oxide film is set to at least 0.01 μm and less than 0.5 μm, whereby weathering resistance and abrasion resistance are significantly improved, and the organic glass laminate is made suitable for use as an exterior member.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.

An insert molding component includes a primary molding section having a concave portion formed in one surface thereof, the concave portion including stepped lower and upper concave portions, an insert component disposed on a bottom surface of the lower concave portion, a heat-insulating component disposed in the upper concave portion above an opening of the lower concave portion in which the insert component is disposed, and a secondary molding section disposed in contact with the one surface of the primary molding section.

An insert molding component includes a primary molding section having a concave portion formed in one surface thereof, the concave portion including stepped lower and upper concave portions, an insert component disposed on a bottom surface of the lower concave portion, a heat-insulating component disposed in the upper concave portion above an opening of the lower concave portion in which the insert component is disposed, and a secondary molding section disposed in contact with the one surface of the primary molding section.

An insert-molded container in which a secondary container made of transparent synthetic resin is integrally provided to the outside of a primary container, the secondary container includes a gate mark, and a vapor-deposited layer is provided on the outer surface of the primary container in a peripheral area of the gate mark is manufactured by a manufacturing method of insert-molded container. The method includes: a cover attaching step of attaching a cover member made of transparent synthetic resin to the outer surface of a part of the primary container where a vapor-deposited layer is provided; a placing step of placing the primary container in a mold with the cover member facing a gate; and an insert molding step of injecting a transparent synthetic resin material from the gate.

An injection mold for encapsulating a substrate comprises a lower mold component and an upper mold component adapted to form an encapsulation mold at an edge of the substrate when the upper mold component engages the lower mold component. The lower mold component comprises a substrate support and wherein the upper mold component comprises a recess. The injection mold includes a tiltable insert sized and shaped to slide within the recess to form a seal for the encapsulation mold, the insert having a substrate-contacting surface defining an area of the substrate contacted by the insert. The injection mold includes a plurality of pressure-exerting actuators connected to the tiltable insert and each being configured to independently apply pressure on the substrate via the insert, wherein the plurality of pressure-exerting actuators are adapted to equilibrate a total predetermined pressure exerted by the insert substantially evenly across the area of the substrate-contacting surface.

A method of manufacturing the cover window includes a film layer and a resin layer disposed on the film layer to surround an edge of the film layer.

An electronic medical device is disclosed here. An exemplary embodiment of the medical device includes a printed circuit board assembly, a protective inner shell surrounding at least a portion of the printed circuit board assembly, and an outer shell surrounding at least a portion of the protective inner shell. The printed circuit board assembly has a printed circuit board, electronic components mounted to the printed circuit board, a battery mounted to the printed circuit board, and an interface compatible with a physiological characteristic sensor component. The protective inner shell is formed by overmolding the printed circuit board assembly with a first material having low pressure and low temperature molding properties. The outer shell is formed by overmolding the protective inner shell with a second material that is different than the first material.