A molding device for producing a molded module. The molding device has one tool part and one further tool part, which together enclose a cavity. At least one of the tool parts has at least one dividing web arranged and configured to subdivide the cavity into at least a low-pressure sub-cavity and a high-pressure sub-cavity. The tool part has at least two feed channels, of which a low-pressure feed channel opens into the low-pressure sub-cavity and has a smaller cross-section at least over a longitudinal portion than a high-pressure feed channel opening into the high-pressure sub-cavity. The low-pressure feed channel is configured to become pressure-resistantly blocked through hardening of the molding compound once a predetermined time interval has elapsed or during the interval. The high-pressure feed channel is configured to conduct a molding pressure into the cavity for a longer time interval than the low-pressure feed channel.

An injection molded composite component includes a groove extending from a first surface of the composite component and a tubing material placed within the groove and formed integrally with the composite component such that the tubing material forms an integrated conduit on the first surface of the composite component.

The invention relates to a polymeric film for coating plastics mouldings with a coating material, the polymeric film comprising an adhesion-modified layer and also a layer of the coating material; where the polymeric film together with the adhesion-modified layer and the layer of the coating material is formable at room temperature; where the coating material wholly or partly covers the adhesion-modified layer; and where the adhesion-modified layer has a layer thickness of at least 0.1 μm; and where the adhesion-modified layer is in direct contact with the coating material. The invention further relates to uses of the polymeric film of the invention, to methods for its production and to methods for coating components using the polymeric film of the invention.

A method for manufacturing a sensor for a motor vehicle. The method includes placing a sensor core in a lower indentation of a mold; the sensor core having a metal lead frame, including connection pins and lateral retention members, and an integrated circuit, including at least one measurement cell and being overmolded on a support zone of the metal lead frame so the lateral retention members and the connection pins are exposed, and an electrically conductive terminal on each connection pin; placing a magnet in line with the overmolded integrated circuit; placing two lateral indentations of the mold on either side of the magnet and the integrated circuit so the lateral indentations retain the lead frame in the vicinity of the lateral retention members; overmolding the integrated circuit, the magnet and part of the lead frame to allow the free end of the terminals to project; and removing the mold.

The resin molded article is molded by using an electrode sheet as an insert in a state where one surface of the electrode sheet is closely attached to an inner surface which serves as the inner side of the operation surface. The electrode sheet is formed by using, as a base material, a thermoplastic synthetic resin sheet which outputs an electrical signal according to the amount of change of electrostatic capacitance generated by a contact operation with respect to the operation surface. At least a whole or a part of the inner surface is formed in a three-dimensionally curved surface, and a passage is formed in the electrode sheet so as to allow a molten resin following in through a gate formed in a die which comes into contact with the other surface of the electrode sheet during molding to pass toward one surface side of the electrode sheet.

A manufacturing method for manufacturing a pipe joint including a circular tube-shaped housing and an elastically deformable circular tube-shaped seal member provided at an inner peripheral side of the housing. The pipe joint manufacturing method includes a process of placing the seal member inside a mold in a state in which the seal member is fitted to an outer periphery of a retaining pin, and a process of causing a molten resin to flow into the mold so as to mold the housing in a state in which the seal member is cooled through the retaining pin.

An insert molding component includes a primary molding section with a concave portion formed on one surface thereof, an insert component disposed on a bottom side of the concave portion of the primary molding section, a heat-insulating component disposed in the concave portion of the primary molding section and disposed on a top of the insert component, and a secondary molding section disposed in contact with the one surface of the primary molding section.

A liftgate (10) for a vehicle having at least one overmolding bracket (28) with at least one open mounting surface on the bracket for liftgate hardware attachments. In addition, overmolding the bracket (28) and maintaining at least one hole (26) for tether routing. The liftgate allows the overmolding of the bracket (28) and maintains a lower cost fastener joint that does not require extra components or special components such a compression limiters and rivet nuts or brackets that cannot be overmolded.

An injector for introducing a fluid includes a main body designed as an insert and including a first tool contact surface for an injection-molding tool and a second tool contact surface for the injection-molding tool; and an injection-molded housing that completely encloses the main body on at least one portion of the main body, the injection-molded housing including at least one first opening that extends linearly towards the main body.

A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.