A molded product having both small specific gravity and high stiffness and also suffering few sink marks is described along with a method for the production thereof, where the molded product includes a porous body (A) integrated with an injection molded body (B), the porous body (A) having an apparent density of 0.05 to 0.8 g/cm.sup.3, the average thickness (tA) of the porous body (A) and the average thickness (tB) of the injection molded body (B) satisfying the relation tA≥3×tB, and the injection molded body (B) covering at least one face of the porous body (A).

Provided is a decorative sheet in which a graphic is less deteriorated even after injection molding. First and second graphic layers contain a plurality of interference pigments that emit respective interference lights having respective colors in a first direction in first and second binders to exhibit first and second mixed colors. An optical functional layer changes a reflectance property of light. The first and second graphic layers represent a graphic visually recognizable from a front surface of a decorative sheet and allow visually recognizing an image displayed on a back surface from the front surface. The optical functional layer increases at least one of ratios of an amount of visible light representing the graphic and an amount of visible light representing the image that transmits through the first and second graphic layers to an amount of visible light reflected by and visible on the front surface.

A method for producing a housing of an air conditioner, in which at least a part of the housing is produced as a plastic part by means of an injection molding process by injecting a plastic into a mold cavity of an injection molding tool, wherein a damping element is placed in the injection mold prior to injection of the plastic into the injection mold so that the damping element establishes a bond with the plastic during injection of the plastic into the injection mold and becomes a component of the injection-molded plastic part.

The invention relates to a method for encapsulating electronic components mounted on a carrier, including the steps of: placing the carrier with electronic components in a mould, introducing a liquid encapsulating material into the at least one mould cavity, wherein the pressure on an upper side remote from the carrier of at least one calibration component mounted on the carrier is measured by at least one pressure sensor located in the contact surface of a mould part. The invention also relates to a mould for encapsulating electronic components mounted on a carrier with such a method.

A semiconductor manufacturing apparatus, including a chip supply module used for providing a plurality of chips; a load plate supply module including a load plate and a load-plate motion platform used for holding the load plate; a chip transfer-loading module including a chip transfer-loading platform used for suctioning chips. The chip transfer-loading platform is used at a first position for transferring chips from the chip supply module. The chip transfer-loading platform carries the chips to a second position to bond the chips onto a load plate to form a bonding sheet. A packaging module is used for packaging the bonding plate on the load-plate motion platform to form a packaged chip.

A molding die includes a first mold assembly, a second mold assembly, and a mold core. The first and second mold assemblies are adapted to be clamped together. The mold core defines a molding groove. The molding core is pressed between the first and second mold assemblies to form a molding cavity. The second mold assembly includes a light transmitting area corresponding to the molding cavity, so that the molding cavity will receive incident light through the light transmitting area. In the molding die, the first mold assembly, the second mold assembly, and the mold core cooperate to form the molding cavity, adhesive is injected into the molding cavity, and the molding cavity receives incident light through the light transmitting area, so that curing efficiency of the adhesive is improved, production efficiency is high, shape of molded adhesive is uniform, and product quality is improved.

A fiber preform is provided for use in an overmolding process that includes a fiber bundle arranged in a predetermined pattern and attached to itself by a plurality of stitches of a thread to form at least one preform layer. At least one positioning element is associated with the at least one preform layer, the at least one positioning element configured to engage with at least one corresponding alignment element on a mold to indicate proper positioning of the fiber preform within the mold. A process of overmolding is also provided in which the at least one positioning element of the fiber preform engages with the at least one corresponding alignment element on the mold to indicate proper positioning. The mold cavity is then filled with a resin to permeate the fiber preform engaging the mold in a unique orientation to yield an article upon resin cure.

An automated in-mold label handling and product unloading device for use with a plastic material injection molding machine includes a label handling arm provided with a label holder at an outer end thereof, and a product unloading arm provided with a product gripper at an outer end thereof. The device has a stationary frame and a first linear guide device that supports the label handling arm so as to reciprocate along a y-axis direction. The device has a second linear guide device that supports the product unloading arm so as to reciprocate along a y-axis direction. The first and second linear guide devices are guided relative to the frame to be movable parallel to the x-axis. A label handling arm x-axis drive mechanism has a first drive motor mounted on the frame and a first transmission coupled to said first drive motor and to the first linear guide device.

An injection molding unit includes a main unit and an optional unit, the main unit accommodating a first injection molding machine that molds an integrated product by injecting a first molding material into a cavity which is defined by a lower die and an upper die and in which an insert member is disposed. The optional unit includes at least one of a member molding unit that accommodates a second injection molding machine that molds the insert member by injecting a second molding material or a press molding machine that molds the insert member in press molding, and a robot unit that accommodates a robot that performs placement operation of placing the insert member in the cavity or transport operation of transporting the integrated product molded by the first injection molding machine. The main unit is so configured that the optional unit is attachable thereto and detachable therefrom.

An injection molding apparatus includes a support that supports a molding die including an upper die and a lower die, and an injection unit that injects a molding material toward a cavity defined by the upper die and the lower die. In the state in which the molding die is supported by the support, the injection unit, the upper die, and the lower die are arranged sequentially from above in the vertical direction. The injection unit includes a rotating flat screw having a groove forming surface in which a groove is formed, a barrel having a flat screw facing surface facing the groove forming surface and having a communication hole into which the molding material flows, and a heater that heats a material supplied to the space between the groove forming surface and the flat screw facing surface, plasticizes at least part of the material through the rotation of the flat screw and the heat produced by the heater to produce the molding material, and delivers the molding material to the communication hole.