The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.

A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.

A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.