B29C65/4855

Elongated Device to Seal a Substrate
20230049659 · 2023-02-16 ·

An elongated device to seal an edge of a substrate has an elongated flexible linear form capable of rolling, akin to a tape. The tape has its own substrate encapsulated by a polyurethane coating. Upon application of heat, the tape welds to a base layer of a fabric, such as nylon. The tape continuously merges into the base and thus prevents intrusion of fluids and gasses through any stitching or other apertures of the base, including any pathogens, microbes, and viruses in the fluids and gasses. The tape resists over forty washings of the conjoined base part of a garment made from the fabric. The tape has proportions that promote a tight seal of the base and comfortable feel to the skin of a wearer of a garment having the tape upon the fabric.

Process for constructing lightning strike protection for adhesively bonded graphite composite joints

A bonded joint for use in bonding composite materials is provided and includes a composite rib having electrically conductive properties and a composite structure having electrically conductive properties. An electrically conductive preform is provided that facilitates a bond between the composite rib and the composite structure. A mesh composition that bonds the composite rib to the preform and that bonds the preform to the composite structure is provided and is electrically conductive to conduct current between the composite rib and the composite structure.

Interlocking frame system and components therefor

A structural assembly for a recreational vehicle includes a first structural frame member and a second structural frame member with a side wall having a slot for receiving the side wall of the first structural frame member through a notch formed in the side wall and upper wall of the first structural frame member. The upper wall of the second structural frame member is located in the notch when the second structural frame member is engaged with the side wall of the first structural frame member with the slot.

High frequency adhesive bonding
11691351 · 2023-07-04 · ·

A system and method for bonding a first layer of material to a second layer of material includes a first electrically conductive plate, a second electrically conductive plate spaced apart from the first electrically conductive plate. The second electrically conductive plate is electrically grounded. A high frequency generator in electrical communication with the first electrically conductive plate supplies high frequency electrical signals to the first electrically conductive plate. An adhesive applied to one of the first and second layers of material has an electromagnetic susceptor material that when subjected to the electric field heats the adhesive to an adhesive curing temperature to bond the first layer of material to the second layer of material. A clamping mechanism applies pressure to one of the first and second layers of material to maintain contact between the first and second layers until an adhesive cure time has lapsed.

Methods of disassembling apparel products having imine adhesives

Embodiments provide methods of disassembling apparel products. The methods include exposing an adhesive of the apparel product to a composition. The adhesive is disposed at least partially disposed between a major component and a minor component of the apparel product. The adhesive includes a material having an imine bond or an iminium bond. The major component forms a base portion of the apparel product and is configured to be supported and worn at least partially over a portion of a wearer. The minor component forms a secondary portion configured to be coupled to the major component via the adhesive. The methods include separating the major component from the minor component adjoined by the adhesive.

METHOD FOR MANUFACTURING SMART CARD, SMART CARD, AND CONDUCTIVE PARTICLE-CONTAINING HOT-MELT ADHESIVE SHEET

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

COMPLIANT JOINT DRIVE ASSEMBLY

A method of forming a dielectric barrier and torque transfer member between a drive shaft and a driven shaft of a torque transfer assembly. The method includes assembling the drive shaft and the driven shaft in axially adjacent relationship to one another, the drive shaft and the driven shaft each having a recess formed therein such that when the shafts are assembled, the recesses cooperate to define a chamber extending across the interface between the drive and driven shaft and into the interior of both the drive and the driven shaft. The method further includes injecting a dielectric adhesive or resin material into the chamber to fill the chamber and to extend across the interface between the drive and the driven shaft, and curing the dielectric material to form a dielectric barrier between and to provide torque transfer between the drive and the driven shaft.

METHOD FOR MANUFACTURING BONDED OBJECT AND BONDED OBJECT MANUFACTURING APPARATUS
20230130441 · 2023-04-27 ·

A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.

Manufacturing method and tool for carbon parts

A method of manufacturing a product including at least two carbon parts including the step of: manufacturing a first carbon part, manufacturing at least a second carbon part, providing on a surface of one of the first carbon part or second carbon part a plurality of protrusions including a carbon resin, joining together the first carbon part and the second carbon part in such a way that the plurality of protrusions is interposed between the first carbon part and second carbon part for providing physical and electrical connection is provided.

Method for manufacturing bonded object and bonded object manufacturing apparatus

A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.