A processing apparatus includes a wafer cassette table, a wafer carrying-out mechanism, a wafer table, a frame housing unit, a frame carrying-out mechanism, a frame table, a tape sticking unit, a tape-attached frame conveying mechanism, a tape pressure bonding unit, a frame unit carrying-out mechanism, a reinforcing part removing unit, a ring-free unit carrying-out mechanism, and a frame cassette table. The wafer carrying-out mechanism includes a Bernoulli chuck mechanism that jets gas to the back surface of the wafer and generates a negative pressure. The gas jetted by the Bernoulli chuck mechanism is inert gas. The wafer carrying-out mechanism jets the inert gas from the Bernoulli chuck mechanism to suppress oxidation of the back surface of the wafer when the wafer is carried out.

An elongated device to seal an edge of a substrate has an elongated flexible linear form capable of rolling, akin to a tape. The tape has its own substrate encapsulated by a polyurethane coating. Upon application of heat, the tape welds to a base layer of a fabric, such as nylon. The tape continuously merges into the base and thus prevents intrusion of fluids and gasses through any stitching or other apertures of the base, including any pathogens, microbes, and viruses in the fluids and gasses. The tape resists over forty washings of the conjoined base part of a garment made from the fabric. The tape has proportions that promote a tight seal of the base and comfortable feel to the skin of a wearer of a garment having the tape upon the fabric.

A method for joining two objects by anchoring an insert portion provided on one of the objects in an opening provided on the other one of the objects. The anchorage is achieved by liquefaction of a thermoplastic material and interpenetration of the liquefied material and a penetrable material, the two materials being arranged on opposite surfaces of the insert portion and the wall of the opening. Before such liquefaction and interpenetration, an interference fit is established in which such opposite surfaces are pressed against each other, and, for the anchoring, mechanical vibration energy and possibly a shearing force are applied, wherein the shearing force puts a shear stress on the interference fit.

A method for producing at least one plastic component (1), wherein in the method the following steps, preferably in the following sequence, preferably cyclically in the following sequence, are carried out: a) providing at least one film (2) and at least one sensor film (3), wherein the at least one film (2) and/or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic polymer; b) applying the at least one sensor film (3) to at least one first region of a surface of the at least one film (2); c) forming the at least one film (2) having the at least one sensor film (3), wherein one or more formed film bodies (4) are made; d) punching out one or more film elements (4a) made from at least one second region of the one or more formed film bodies (4), and a device (10) and a plastic component (1).

A method for producing at least one plastic component (1), wherein in the method the following steps, preferably in the following sequence, preferably cyclically in the following sequence, are carried out: a) providing at least one film (2) and at least one sensor film (3), wherein the at least one film (2) and/or the at least one sensor film (3) has at least one thermoplastic material or at least one thermoplastic polymer; b) applying the at least one sensor film (3) to at least one first region of a surface of the at least one film (2); c) forming the at least one film (2) having the at least one sensor film (3), wherein one or more formed film bodies (4) are made; d) punching out one or more film elements (4a) made from at least one second region of the one or more formed film bodies (4), and a device (10) and a plastic component (1).

An example method of joining a first structure and a second structure is described that includes forming a bond cavity between a first structure and a second structure, placing a semi-permeable breather material at one or more exits of the bond cavity, placing a vacuum bag around the bond cavity and the semi-permeable breather material, evacuating the bond cavity via a vacuum port and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated, and curing the adhesive via one or more heaters to bond the first structure to the second structure.

There is described a method for forming a tube (3) of a web (4, 4) of packaging material comprising the steps of advancing the web (4) of packaging material along a web advancement path (P), overlapping a first lateral edge (19) of the web (4, 4′) of packaging material with a second lateral edge (20) of the web (4, 4) of packaging material for obtaining a longitudinal seam portion of the tube (3) and fusing at least an internal outer surface (34) of the first lateral edge (19) and an external outer surface (37) of the second lateral edge (20) with one another for longitudinally sealing the seam portion of the tube (3). The step of fusing comprises at least the substeps of directly heating the external outer surface (37) of the second lateral edge (20) and heating by contact the internal outer surface (34) by establishing contact between the internal outer surface (34) and the directly heated external outer surface (37).

A substrate usable with a double-side adhesive strip to suspend the substrate to a wall surface. The substrate can have one or more access holes located within an outer perimeter of the substrate. Each access hole has an inner perimeter inwardly of the outer perimeter that is sized and shaped to allow a tab of the double-sided adhesive strip to be extracted through the inner perimeter, after the substrate is suspended on the wall surface. Various articles can attach to the suspended substrate, such as through magnetic attachment, a hook, or a shelf.

A substrate usable with a double-side adhesive strip to suspend the substrate to a wall surface. The substrate can have one or more access holes located within an outer perimeter of the substrate. Each access hole has an inner perimeter inwardly of the outer perimeter that is sized and shaped to allow a tab of the double-sided adhesive strip to be extracted through the inner perimeter, after the substrate is suspended on the wall surface. Various articles can attach to the suspended substrate, such as through magnetic attachment, a hook, or a shelf.

Tape and method to mask a structure. The tape includes a base layer having length, width, outside surface, inside surface, and top edge spaced from bottom edge. A first portion of the width of the inside surface includes a first tacky adhesive layer connected to the inside surface and located adjacent the top edge. A second portion of the width of the inside surface includes a second tacky adhesive layer connected to the inside surface and located adjacent the bottom edge. At least a portion of the base layer includes a water impermeable area that prevents water adjacent the outside surface from reaching the inside surface by passing through the base layer. And, a third portion of the width of the inside surface of the base layer includes a non-tacky area located between the first tacky adhesive layer and the second tacky adhesive layer.