Side portions of a guide member mounting portion of the instrument panel include a panel side welding guide surface integrally formed therewith. The panel side welding guide surface is spaced apart from the back surface of the instrument panel. Side portions of the guide member include a guide side welding guide surface integrally formed with the guide member. The panel side welding guide surface and the guide side welding guide surface overlap each other. One of the guide side welding guide surface and the panel side welding guide surface includes a position regulating recess. The other of the guide side welding guide surface and the panel side welding guide surface includes a position regulating protrusion that fits into the position regulating recess during vibration welding.

Methods and apparatus for positioning a structure on a polymer layer are described. A method may involve forming a first polymer layer. The method may further involve positioning, by an apparatus, a structure on the first polymer layer, where the apparatus comprises a rod having a first end that supports the structure as the structure is being positioned and a plunger located around the first end of the rod that presses the structure onto the first polymer layer as the structure is being positioned. And the method may involve forming a second polymer layer over the first polymer layer and the structure, where the first polymer layer defines a first side of a body-mountable device and the second polymer layer defines a second side of the body-mountable device opposite the first side.

Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

A display protector attachment apparatus for a foldable electronic device according to the present disclosure includes: a frame unit including a frame-first end member at one end and a frame-second end member at the other end and configured to support and accommodate the foldable electronic device between the frame-first end member and the frame-second end member; and an inclination-forming fixing unit connected to the frame-second end member and configured to align a protector film assembly to be arranged inclinedly with respect to the foldable display unit of the foldable electronic device by varying mounting heights for both ends of the protector film assembly including a display protector that is to be attached to the foldable electronic device.

A connection device for plastic pipe elements (1) which allows performing pre-assembly and being finally assembled without requiring skilled labor, having a pipe element (1) with at least one end, a plastic connection element (2) which is connected to an outer surface of the pipe element (1) through the end, which has a resistance wire (3) wound on the outer surface of the pipe element (1) itself.

The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.

Provided herein is a spar cap having a profile for guiding and receiving a shear web for wind turbine blade. Particularly, the present disclosure provides a pultruded spar cap having a bond gap feature to maintain a uniform space for distribution of bonding paste between the spar cap and shear web. Also, the spar cap is formed with locating features which guide and receive placement of the shear web.

An end member assembly is dimensioned for securement to an associated flexible spring member. End member assembly includes first, second and third end member sections. First end member section includes a first outer peripheral wall portion. Second end member section includes a second outer peripheral wall portion. Second end member section is positioned in abutting engagement with the first end member section such that a groove extends peripherally around first and second end member sections between first and second outer peripheral wall portions. Third end member section is injection molded in situ with first and second end member sections such that third end member section extends peripherally around first and second end member sections within groove. Gas spring assemblies and vehicle suspension systems are also included.

An air conditioning piping system of the disclosure includes a refrigerant pipe made of a plastic material and configured to provide a fluid flow between components constituting an air conditioning system; at least one connection flange made of the plastic material and configured to provide a connection between the refrigerant pipe and components constituting the air conditioner system; and at least one charging port made of the plastic material and having a charging valve configured to inject a refrigerant into the refrigerant pipe.

A method for determining the curing behavior of an adhesive- or sealant bead, the adhesive- or sealant bead being applied to a workpiece, places multiple test bodies on the adhesive- or sealant bead at different, pre-defined placement times, and deformations of the adhesive- or sealant bead, caused by the test bodies, are measured at a pre-defined end time.