A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide20 C. to the glass transition temperature Tg+50 C.

A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide20 C. to the glass transition temperature Tg+50 C.

A method for manufacturing a bonded body according to the present disclosure includes: obtaining a first composite that includes a first outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a first inner portion surrounded by the first outer layer portion and containing silicon carbide and silicon; obtaining a second composite that includes a second outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a second inner portion surrounded by the second outer layer portion and containing silicon carbide and silicon; grinding or polishing a first contact surface at which the first inner portion is in contact with the second inner portion and/or a second contact surface at which the second inner portion is in contact with the first inner portion; and bringing the first contact surface and the second contact surface into contact with each other and performing thermal treatment in a vacuum atmosphere or an inert gas atmosphere.

Infrared transmitting glasses bonded into an optical element without interlayer voids by stacking at least two different infrared transmitting glasses inside a vessel where each glass has a different refractive index, a different dispersion, or both, and where the glasses all have similar viscosities, thermal expansion coefficients, and glass transition temperatures; placing a weight on top of the stack; applying a vacuum to the vessel; applying an isostatic pressure of at least 1500 psi; and after releasing the isostatic pressure, annealing at a temperature within 10 C. of the glass transition temperature at a pressure between 0 and 1000 psi. Applying the vacuum, applying the isostatic pressure, and annealing are done sequentially and with no intermediate transitions to ambient temperature or pressure.

Provided are a method and an apparatus for producing a film with a coating solution including a material whose performance is deteriorated by oxygen functional film, without performance deterioration. The apparatus for producing a functional film includes a coating device which has a backup roller and a die coater and applies a coating solution having a dissolved oxygen concentration of 1000 ppm or less and including 10000 ppm or less of an organic solvent to a flexible support transported in a state where the support is wound around the backup roller to form a coated film, a lamination device which laminates a coated surface of the coated film and the film on the backup roller, and an inert gas atmosphere forming device which forms an inert gas atmosphere in a space including the coated surface from a coating start position to a lamination start position on the backup roller.

A method for bonding infrared transmitting glasses into an optical element without interlayer voids by stacking at least two different infrared transmitting glasses inside a vessel where each glass has a different refractive index, a different dispersion, or both, and where the glasses all have similar viscosities, thermal expansion coefficients, and glass transition temperatures; placing a weight on top of the stack; applying a vacuum to the vessel; applying an isostatic pressure of at least 1500 psi; and after releasing the isostatic pressure, annealing at a temperature within 10 C. of the glass transition temperature at a pressure between 0 and 1000 psi. Applying the vacuum, applying the isostatic pressure, and annealing are done sequentially and with no intermediate transitions to ambient temperature or pressure. Also disclosed is the related optical element made by this method.

The stack manufacturing apparatus includes a first supporting body supply unit which is configured to intermittently unroll a roll sheet-shaped first supporting body and includes one of a pair of tension applying devices capable of applying tension to the unrolled first supporting body; a first adhesive layer formation unit configured to form a first adhesive layer over the first supporting body while the first supporting body supply unit suspends unrolling of the first supporting body; a first bonding unit configured to bond the first supporting body and a sheet-shaped member using the first adhesive layer; and a control unit which is configured to hold an end portion of the first supporting body and includes the other of the pair of tension applying devices.

A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate.