A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

There is provided a laminate in which when the protective plate breaks due to an impact, not only the scattering of large broken pieces but the scattering of powdery fine broken pieces can be suppressed. A laminate including an adherend and an adjacent layer, wherein the adherend has a first major surface, a second major surface being a back surface of the first major surface, and a lateral surface connecting an edge of the first major surface and an edge of the second major surface, at least the first major surface and the lateral surface of the adherend are covered with the adjacent layer, the adjacent layer has at least a plastic film and a hard coat layer containing a cured product of a curable resin composition in this order from the adherend side, and a softening point F1 of the plastic film and a softening point F2 of the hard coat layer satisfy a relationship of F1<F2.

An affixing method includes a pressing step of pressing a tape against a wafer with a tape affixing roller and pressing the wafer against a suction table with the tape affixing roller, an evacuating step of evacuating a vacuum chamber that houses the suction table and the tape affixing roller therein to create a vacuum in the vacuum chamber, and an affixing step of affixing the tape to the wafer with the tape affixing roller by causing the tape affixing roller to roll on the tape while the tape affixing roller is pressing the wafer.

A method for laminating an assembled sandwich structure consisting of a functional part (4) and one glass article (5) separated from an outer surface of the functional part by a laminating film (6) by heating with electromagnetic radiation in a vacuum is described. In the method equal temperatures of all sandwich components are provided by selection of the optimal radiation frequencies. The optimal vacuum level is provided following the laminating film temperature.

A membrane assembly for vacuum bagging includes an elongate sheet of flexible material capable of being rolled up into a cylindrical configuration and unrolled from the cylindrical configuration into a flattened-out configuration, a bistable tape spring attached to or captured by the elongate sheet, and an inflatable tube attached to or captured by the elongate sheet. The bistable tape spring has a first stable state which is a straightened-out state, a second stable state which is a rolled-up state, and a transition state between the first and second stable states. The inflatable tube is sealed at one end and has an orifice at the other end for admission of a fluid therethrough for inflation of the inflatable tube.

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed between the plates, and a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient. Multiple such sets of plates may be used to form an enclosure for a device that thermally insulates the device from ambient.

A process for placing a circuit array on a sheet having adhesive during a pick and place operation in which a vacuum is used during its placement to minimize air bubbles between the adhesive layer and the circuit array.

The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 μm and an in-plane thermal conductivity of even reaching 1700 W/mK or above.

A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.