This invention provides a roll-bonded laminate that is excellent in press workability and/or a roll-bonded laminate with improved performance and ease of handling at the time of production. More specifically, this invention relates to a roll-bonded laminate composed of a stainless steel layer and an aluminum alloy layer with the peel strength of 60 N/20 mm or higher, a roll-bonded laminate composed of a stainless steel layer and a pure aluminum layer with the peel strength of 160 N/20 mm or higher, and a roll-bonded laminate composed of a pure titanium or titanium alloy layer and an aluminum alloy layer with the peel strength of 40 N/20 mm or higher.

Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting the laminate structures to at least one thermal cycle comprising cooling the laminate structures to a first temperature near or below room temperature and heating the laminate structures to a second temperature near or below the lamination temperature. Also disclosed herein are laminate structures made according to such methods.

A sheet processing apparatus sandwiches a sheet media in a two-ply sheet in which two sheets are overlaid and bonded together at a portion of the two-ply sheet. The sheet processing apparatus includes a fixing device, a tray, and a roller. The fixing device applies heat and pressure to the two-ply sheet. The tray is disposed downstream from the fixing device in a conveyance direction of the two-ply sheet, to stack the two-ply sheet. The roller conveys the two-ply sheet vertically downward toward the tray after the two-ply sheet passes through the fixing device.

Transaction and identification cards formed from raw bamboo assemblies including one or more raw bamboo layers optionally adhered to a paper backer. In one embodiment, a single raw bamboo assembly is adhered to a base or core substrate. Optionally, a second bamboo assembly is coupled to the first bamboo assembly, with or without a core layer sandwiched in between the bamboo assemblies, such that the card's top face includes a first bamboo layer and the card's bottom face includes a second bamboo layer. One or more image or graphic layers are then either printed directly onto the raw bamboo layer or laminated thereto. Optional protective substrates, films, or coatings are applied to or over the bamboo assembly to protect by sandwiching the one or more ink or printed layers between the protective layer and the raw bamboo layers.

Manufacturing a semiconductor apparatus includes preparing a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base, coating a semiconductor-device mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor-device forming surface of a wafer on which semiconductor devices are formed with the thermosetting resin layer of the support-base attached encapsulant, heating and curing the thermosetting resin layer to collectively encapsulate the semiconductor-device mounting surface of the substrate or the semiconductor-device forming surface of the wafer, and cutting the encapsulated substrate or wafer by dicing. Coating includes surrounding a side face of the support-base attached encapsulant by a frame mechanism, holding the substrate or the wafer with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, and vacuum laminating the support-base attached encapsulant together with the substrate or the wafer.

In a first aspect, a multilayer film includes a holographic image layer, a first heat-shrinkable layer and a first adhesive layer between the holographic image layer and the first heat-shrinkable layer. In a second aspect, an authentication label includes a holographic image layer, a first heat-shrinkable layer, a first adhesive layer between the holographic image layer and the first heat-shrinkable layer, and a back adhesive layer.

A method for forming of a building panel with a surface including a thermosetting resin such that tension created during curing of the surface is reduced or eliminated. Method for producing a panel with a wood based core and a surface layer including a thermosetting resin wherein the method including: curing and connecting the surface layer to the core while applying heat and pressure in a first main pressing step, thus raising a temperature of the surface layer above an initial temperature; applying a bending force on the panel after the first main pressing step to bend the panel such that an uppermost surface of the panel is convex an a lowermost surface of the panel is concave while the panel is still above the initial temperature; and releasing the bending force such that the panel springs back to an essentially flat shape.

In some implementations, an electronic device includes a display stack to display content. The display stack can include a number of substrates coupled using a liquid optically clear adhesive (LOCA). In some implementations, the LOCA can have a modulus of elasticity of no greater than 80,000 Pa. Additionally, the display stack can be formed using a process that includes applying an external force to the display stack by placing the display stack between two fixtures. In an implementation, the external force can be applied while heating the display stack at a temperature of at least 60° C. and cooling the display stack according to a particular cooling rate.

A glass laminate includes a non-glass substrate with a first surface and a second surface opposite the first surface. A glass sheet is laminated to the first surface of the non-glass substrate. A barrier film is laminated to the second surface of the non-glass substrate and includes a first surface adjacent to the non-glass substrate, a second surface opposite the first surface. A thickness of the barrier film can be at most about 0.5 mm. The second surface of the barrier film can define an outer surface of the glass laminate. The barrier film can be a multi-layer barrier film with a metal layer and a polymer layer. An absolute value of a flatness of the glass laminate determined according to European Standard EN 438 after exposure to 23° C. and 90% relative humidity for 7 days can be at most about 3 mm/m.

A substrate suctioning device includes a table having a suction surface suctioning a substrate, and a plurality of suction units provided on the suction surface of the table. The substrate suctioning device includes a control unit that, with setting a group of suction unit(s) among the plurality of suction units as a starting point, sequentially decompresses a plurality of remaining suction units disposed in a direction away from the group of suction unit(s) as the starting point, along the direction away from the group of suction unit(s) as the starting point.