This invention relates to a method for forming a panel or skin for a hollow core door, a method of manufacturing a said door, a hollow core door, a panel, and an apparatus for forming a panel and skin for a hollow core door. The method comprises providing a substrate comprising a patterned groove therein; applying a laminating material on the substrate with an adhesive. The method then comprises sealing the substrate with the laminating material thereon in a chamber and providing at least one deformable membrane adjacent the laminating material; removing air from the chamber wherein under vacuum, the deformable membrane deforms into the groove thereby urging the laminating material into the groove; heating the laminating material to facilitate bonding thereof to the substrate; and allowing the substrate with the laminating material thereon to cool so as to form a panel with the laminating material bonded thereto.

Methods and apparatus to vent gas and vapor from a panel via venting channels for a decorative layer are disclosed. An example apparatus includes a decorative layer, an adhesive layer to couple the decorative layer to a panel, and a resin layer disposed between the decorative layer and the adhesive layer. The adhesive layer is coupled to a first side of the resin layer. The decorative layer is coupled to a second side of the resin layer. The first side of the resin layer defines venting channels to vent at least one of gas or vapor away from the decorative layer to deter the at least one of gas or vapor from exerting a pressure on the decorative layer to deter separation of a portion of the decorative layer from the resin layer. The venting channels have a depth to impede the adhesive layer from filling the venting channels.

At least one puck is used to manufacture a vacuum insulated panel with a shaped opening. A pair of barrier films are positioned about an insulated core having a shaped opening such as a through bore, cutout, or relief. The puck includes a protrusion having a shape similar to that of the opening of the insulated core. With the barrier films positioned about the insulated core, the pucks are inserted into the opening from opposite sides of the insulated core to thereby compress the barrier films between the shaped protrusions of the pucks to thereby prevent wrinkles and/or creases in the barrier films. The insulated core is then subjected to a vacuum to evacuate the insulated core of any gases and the barrier films are heat sealed to maintain the insulated core in the evacuated state. Excess barrier film is then removed to provide a wrinkle and/or crease free seal.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.

The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

Devices, methods and systems disclosed herein relate to the application of a protective film on a surface of an electronic device that instantly reduces air bubbles and eliminates the waiting time usually required when using a wet fluid solution. In one embodiment, a flange may be configured to couple to the protective film. The flange may aid in the accurate application of the protective film to the electronic device.