A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

A liquid discharge device includes a first discharge portion, a second discharge portion, a first drive circuit outputs a first drive signal that the first discharge portion discharges a liquid having a first discharge amount, a second drive circuit outputs a second drive signal that the first discharge portion does not discharge a liquid, a third drive circuit outputs a third drive signal that the second discharge portion discharges a liquid having a second discharge amount, and a fourth drive circuit outputs a fourth drive signal that the second discharge portion does not discharge the liquid, in which the third drive circuit is located between the first drive circuit and the second drive circuit along the one direction, and a shortest distance between the fourth drive circuit and the second drive circuit is shorter than a shortest distance between the fourth drive circuit and the third drive circuit.

A fluid ejection head assembly having improved assembly characteristics and methods of manufacturing a fluid ejection head assembly. The fluid ejection head includes a fluid supply body having at least one fluid supply port in a recessed area therein and a semiconductor chip attached in the recessed area of the fluid supply body adjacent the fluid supply port using a thermal cure adhesive. A compression prevention body having a coefficient of thermal expansion ranging from about 1.0 to less than about 30 microns/meter per ° C. disposed adjacent to the fluid supply port of the fluid supply body and the semiconductor chip.

A liquid ejection head includes: head units arranged in a first direction; first individual heat dissipators each corresponding to one of the head units and disposed on a first side of the head unit in a second direction; and a first common heat dissipator disposed on the first side of the head units in the second direction. The first common heat dissipator extends in the first direction and shared among the head units. Each head unit includes: a unit body including an actuator; and a first driver integrated circuit disposed on the first side of the unit body in the second direction. Each of the first individual heat dissipators is disposed between the first driver integrated circuit and the first common heat dissipator of the head unit so as to be in thermal contact with the first driver integrated circuit and the first common heat dissipator.

A print head assembly comprises a print head unit, a cooling duct, and a blower arranged to pass a gaseous cooling medium through the cooling duct.

The cooling duct has an elongated closed hollow cross-section bounded on at least one side by a flat wall. The print head unit is attached to the flat wall outside of the cooling duct such that the print head unit is cooled by the gaseous medium passing through the cooling duct via thermal contact through the flat wall of the cooling duct.

Provided is a liquid ejection head including: a plurality of recording element substrates including energy generating elements that generate ejection energy for ejecting liquid from ejection orifices; a first support member that supports the plurality of recording element substrates such that the recording element substrates are arranged in one or more lines on a main surface of the first support member; and a second support member that supports the first support member on a surface opposite to the main surface. A first thermal resistance concerning an in-plane direction parallel to the main surface, of a region between the recording element substrates in the first support member is higher than a second thermal resistance concerning a thickness direction of the second support member, of a projection region that overlaps with each recording element substrate in the second support member.

Provided is a liquid ejection apparatus capable of cooling a control board of a liquid ejection head without cooling a liquid supply path. Ae liquid ejection unit ejects ink onto paper. Ae control board controls the operation of the liquid ejection unit. Ae head housing covers and houses the control board inside thereof. Ae liquid supply path supplies ink to the liquid ejection head. Ae main body housing covers and houses a portion of the liquid ejection head except for the liquid ejection unit. A fan causes air to flow between the main body housing and the head housing. The liquid supply path is inserted from the outside to the inside of the main body housing in the vicinity of the liquid ejection head, and is connected to the liquid ejection head.

A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

A liquid ejection head having at least one energy generation element for generating heat to be used for ejecting a liquid includes an insulating layer which is provided in contact with a substrate and supports the energy generation element; at least one heat transmitting layer which is composed of a material having a higher thermal conductivity than that of a material of the insulating layer and which is provided, in the insulating layer, between the energy generation element and the substrate; and a heat transmitting member which thermally connects the at least one heat transmitting layer and the substrate, wherein the heat transmitting member is connected to an area, on the heat transmitting layer, excluding an area directly below the energy generation element in a position interposed between the energy generation element and the substrate.

A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.