A vehicle engine is provided that includes an exhaust manifold configured to emit a first emission. A heat shield is positioned proximate the exhaust manifold and has a shield substrate defining an aperture. An indicator is positioned over the aperture with a support substrate and a semiconductor layer. The semiconductor layer is configured to absorb the first emission and emit a second emission.

A vehicle engine is provided that includes an exhaust manifold configured to emit a first emission. A heat shield is positioned proximate the exhaust manifold and has a shield substrate defining an aperture. An indicator is positioned over the aperture with a support substrate and a semiconductor layer. The semiconductor layer is configured to absorb the first emission and emit a second emission.

A vehicle emissions system is provided that includes a tail pipe configured to emit a first emission, a heat shield positioned proximate the tail pipe having a shield substrate. A semiconductor layer is positioned on the shield substrate and configured to convert the first emission into a second emission. An overmold is positioned over the semiconductor layer.

A vehicle engine is provided that includes an exhaust manifold configured to emit a first emission. A heat shield is positioned proximate the exhaust manifold and has a shield substrate defining an aperture. An indicator is positioned over the aperture with a support substrate and a semiconductor layer. The semiconductor layer is configured to absorb the first emission and emit a second emission.

A vehicle engine is provided that includes an exhaust manifold configured to emit a first emission. A heat shield is positioned proximate the exhaust manifold and has a shield substrate defining an aperture. An indicator is positioned over the aperture with a support substrate and a semiconductor layer. The semiconductor layer is configured to absorb the first emission and emit a second emission.

A vehicle emissions system is provided that includes a tail pipe configured to emit a first emission, a heat shield positioned proximate the tail pipe having a shield substrate. A semiconductor layer is positioned on the shield substrate and configured to convert the first emission into a second emission. An overmold is positioned over the semiconductor layer.

An illumination assembly for a vehicle includes an energy harvesting module disposed on an exhaust pipe of the vehicle. The energy harvesting module includes an energy harvesting device configured to capture heat and to convert the harvested heat to electrical energy. An illumination member is electrically connected to the energy harvesting module and is configured to be illuminated by the electrical energy supplied from the energy harvesting device.

An illumination assembly for a vehicle includes an energy harvesting module disposed on an exhaust pipe of the vehicle. The energy harvesting module includes an energy harvesting device configured to capture heat and to convert the harvested heat to electrical energy. An illumination member is electrically connected to the energy harvesting module and is configured to be illuminated by the electrical energy supplied from the energy harvesting device.