The present invention relates to a suction device, including a body. A cavity is disposed in the body. The cavity has a closed end face and an open end face. The open end face forms an end face to suck a workpiece. A tangential nozzle is disposed on a sidewall surface of the cavity. An external fluid enters the cavity through the tangential nozzle along a tangential direction of the cavity. A suction hole is disposed on the closed end face. The suction hole is connected to a suction unit. The suction unit sucks the fluid in the cavity through the suction hole. The suction device can suck a workpiece by using both a rotational flow negative pressure and a negative suction pressure of a fluid in the cavity, and therefore can suppress impact of a workpiece surface on a suction force and generate a larger suction force.

This disclosure is directed to automated warehouse facilities that are configured to assemble mixed pallets. The warehouse facilities can include one or more layer handling devices that are configured to remove layers from pallets in a delayering operational mode, and to add layers to pallets in a palletizing operation mode. The warehouse facilities also may include one or more item retrieval devices that are configured to retrieve individual items from storage racks. The warehouse facilities can include other automated devices as well.

This disclosure is directed to automated warehouse facilities that are configured to assemble mixed pallets. The warehouse facilities can include one or more layer handling devices that are configured to remove layers from pallets in a delayering operational mode, and to add layers to pallets in a palletizing operation mode. The warehouse facilities also may include one or more item retrieval devices that are configured to retrieve individual items from storage racks. The warehouse facilities can include other automated devices as well.

A wafer suspension fork has a body and a cover. The body has a connection portion having multiple inlets and two arms being symmetrical in shape and protruding from the connection portion. Each arm has a holding surface, a flowing surface, multiple inner and outer inclined holes formed in the holding surface arranged along a protruding direction, an inner flowing channel formed in the flowing surface and communicating with the inner inclined holes and the inlets, and an outer flowing channel formed in the flowing surface and communicating with the outer inclined holes and the inlets. The cover is fixed to a bottom surface of the body. A wafer is able to be suspended and held above the two arms by adjusting pressure of gas flowing out from the inner and outer inclined holes and is able to be moved free from being scratched.

A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.

An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

A substrate treating apparatus includes a carrier platform, a transport mechanism, and a controller. The carrier platform places a carrier thereon. The carrier includes a plurality of shelves arranged in an up-down direction. The shelves are each configured to place one substrate thereon in a horizontal posture. The transport mechanism is configured to transport a substrate to a carrier placed on the carrier platform. The controller controls the transport mechanism. The transport mechanism includes a hand and a hand driving unit. The hand supports a substrate. The hand driving unit moves the hand. The controller changes a height position of the hand when the hand is inserted between two of the shelves adjacent to each other in the up-down direction, depending on a shape of a substrate taken from or placed on one of the shelves by the transport mechanism.

An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.

An apparatus, system and method for providing a manufacturing gripping nozzle. The apparatus, system and method for gripping an in-process component during processing may include: a chuck; at least two walls extending from the chuck; at least two peripheral guides having a size and shape correspondent to a periphery of the component and placed atop the at least two walls distal from the chuck, wherein the at least two peripheral guides are capable of positionally maintaining the periphery during the processing; and at least one Bernoulli cup within a cavity bounded by the chuck, the at least two walls, and the component, wherein the at least one Bernoulli cup non-contactedly grips the component.

This disclosure is directed to automated warehouse facilities that are configured to assemble mixed pallets. The warehouse facilities can include one or more layer handling devices that are configured to remove layers from pallets in a delayering operational mode, and to add layers to pallets in a palletizing operation mode. The warehouse facilities also may include one or more item retrieval devices that are configured to retrieve individual items from storage racks. The warehouse facilities can include other automated devices as well.