The purpose of the present invention is to improve the pressure resistance of a cavity in a semiconductor sensor device employing a resin package, and to do so without adversely affecting the embeddability of an electrically conductive member. The semiconductor sensor device has a gap 1a sealed in an airtight manner inside a laminate structure of a plurality of laminated substrates 1, 4, and 5, and has a structure in which the outside of the laminate structure is covered by a resin, wherein a platy component 2 having at least one side that is greater in length than the length of one side of the gap 1a along this side is arranged to the outside of an upper wall 1b of the gap 1, the upper wall 1b of the gap being mechanically suspended by the platy component 2.

The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.

A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.

The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.

A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.

Provided are a device, method, and computer-readable recording medium for detecting an earthquake in a microelectromechanical system (MEMS)-based auxiliary seismic observation network. The method includes performing detrending of removing a moving average from original acceleration data received from single sensors of an MEMS-based auxiliary seismic observation network to preprocess the acceleration data, calculating a short-term average/long-term average (STA/LTA) value using a filter parameter value specified on the basis of the preprocessed acceleration data, generating an event occurrence message or event end message on the basis of the calculated STA/LTA value and transmitting the event occurrence message or event end message, when the event occurrence message is generated, calculating an earthquake probability through an earthquake detection deep learning model using the preprocessed acceleration data as an input, and analyzing noise by calculating a power spectral density (PSD) from the original acceleration data which is merged at certain intervals.

One of the main objects of the present invention is to provide a vibration sensor with improved sensitivity. To achieve the above-mentioned object, the present invention provides a vibration sensor including a circuit board assembly; a housing fixed to the circuit board assembly for forming an accommodation space cooperatively with the circuit board assembly; and a diaphragm assembly accommodated in the accommodation space and secured to the circuit board assembly. The diaphragm assembly includes a gasket fixed to the circuit board assembly, and a first diaphragm fixed to a side of the gasket away from the circuit board assembly. The sensor further includes a vibration cavity enclosed by the gasket, the first diaphragm, and the circuit board assembly, and a MEMS microphone accommodated in the vibration cavity and electrically connected to the circuit board assembly.

The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.

A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

The present disclosure belongs to the field of geological exploration, and particularly relates to a seismic acquisition system and a sensor based on an MEMS sensor with low power consumption, so as to solve the problem that the existing seismic wave acquisition technology cannot balance high accuracy and low power consumption when the MEMS sensor is used. The present disclosure comprises: the MEMS sensor is used for receiving seismic wave signals and outputting MEMS sensor electrical signals; a common-mode voltage adjustment module is used for adjusting the MEMS sensor signals to be within the input range of common-mode voltage of a readout circuit, so as to obtain low voltage MEMS sensor signals. In the present disclosure, high voltage ensures the detection accuracy of the MEMS sensor; and low voltage is supplied to the readout circuit, thereby reducing the power consumption of the overall seismic acquisition system.