A dry-state non-contact method for patterning of nanostructured conducting materials is disclosed. Short self-generated electron-emission pulses in air at atmospheric pressure can enable an electron-emission-based (field enhancement) interaction between a sharp tungsten tip and elements of the nanostructured materials to cause largely non-oxidative sequential decomposition of the nanostructured elements. Embodiments can employ a substrate/tip gap of 10 to 20 nm, discharge voltages of 25-30 V, and patterning speeds as fast as 10 cm/s to provide precisely patterned nanostructures (<200 nm) that are largely free of foreign contaminants, thermal impact and sub-surface structural changes.

A dry-state non-contact method for patterning of nanostructured conducting materials is disclosed. Short self-generated electron-emission pulses in air at atmospheric pressure can enable an electron-emission-based (field enhancement) interaction between a sharp tungsten tip and elements of the nanostructured materials to cause largely non-oxidative sequential decomposition of the nanostructured elements. Embodiments can employ a substrate/tip gap of 10 to 20 nm, discharge voltages of 25-30 V, and patterning speeds as fast as 10 cm/s to provide precisely patterned nanostructures (<200 nm) that are largely free of foreign contaminants, thermal impact and sub-surface structural changes.

A wafer processing method is disclosed to divide a wafer of glass substrate into individual chips along division lines. In the shield tunnel forming step, a pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at a region corresponding to each division line so that a plurality of shield tunnels which are each formed of perforations and affected regions surrounding the perforations are formed along the division lines, respectively. In the modified layer forming step, another pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at the region corresponding to each division line so that modified layers are formed in addition to the shield tunnels along the division lines, respectively. In the dividing step, an external force is applied to the wafer to divide the wafer into individual chips.

For the purpose of shortening the MEMS manufacturing TAT, the MEMS manufacturing method according to the present invention includes a step of extracting the first MEMS with first characteristic in a range approximate to the required characteristic from the plurality of MEMS preliminarily prepared on the main surface of the substrate, and a step of forming a second MEMS having the required characteristic by directly processing the first MEMS.

An electrostatic chuck table includes a plate-shaped base portion capable of transmitting a laser beam to be applied to a workpiece and an electrostatic attraction electrode portion capable of transmitting the laser beam. The laser beam has a transmission wavelength to the workpiece. The base portion has a first surface and a second surface opposite to the first surface. The electrode portion is formed on the first surface of the base portion. A method for using the electrostatic chuck table includes a workpiece holding step of applying a voltage to the electrode portion formed on the first surface to thereby electrostatically hold the workpiece on the second surface, and a modified layer forming step of applying the laser beam through the first surface to a predetermined position inside the workpiece held on the second surface to thereby form a modified layer inside the workpiece.

Apparatus, methods and systems for nano/micro machining. A lathe head has a microscopic pivot aperture for seating a conical tip. The conical tip is carried on a turnable part at one end thereof and is polished down to a microscopic apex. The microscopic pivot aperture is dimensioned for seating the concentric tip in the pivot aperture such that an apex of the conical tip protrudes through and beyond the aperture to a position in close proximity with the aperture. A driver system can comprise a rotator for axially rotating the turnable part, including the conical tip seated in the pivot aperture, and a forward pressure applicator for concurrently applying forward pressure to the conical tip in the direction of the pivot aperture. A light/particle beam system can be utilized to machine the rotating conical tip and the rotating turnable part, including the tip, can be easily removed after machining.

A wafer processing method is disclosed to divide a wafer of glass substrate into individual chips along division lines. In the shield tunnel forming step, a pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at a region corresponding to each division line so that a plurality of shield tunnels which are each formed of perforations and affected regions surrounding the perforations are formed along the division lines, respectively. In the modified layer forming step, another pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at the region corresponding to each division line so that modified layers are formed in addition to the shield tunnels along the division lines, respectively. In the dividing step, an external force is applied to the wafer to divide the wafer into individual chips.

Apparatus, methods and systems for nano/micro machining. A lathe head has a microscopic pivot aperture for seating a conical tip. The conical tip is carried on a turnable part at one end thereof and is polished down to a microscopic apex. The microscopic pivot aperture is dimensioned for seating the concentric tip in the pivot aperture such that an apex of the conical tip protrudes through and beyond the aperture to a position in close proximity with the aperture. A driver system can comprise a rotator for axially rotating the turnable part, including the conical tip seated in the pivot aperture, and a forward pressure applicator for concurrently applying forward pressure to the conical tip in the direction of the pivot aperture. A light/particle beam system can be utilized to machine the rotating conical tip and the rotating turnable part, including the tip, can be easily removed after machining.

A method for manufacturing a fastening element including a step of producing a blank of the fastening element including a head and a shank connected to each other, followed by a step of forming an impression in the head, the forming step including an operation of machining the impression, carried out with a cutting member and an operation of matting a target surface of the impression carried out with a matting member.

For the purpose of shortening the MEMS manufacturing TAT, the MEMS manufacturing method according to the present invention includes a step of extracting the first MEMS with first characteristic in a range approximate to the required characteristic from the plurality of MEMS preliminarily prepared on the main surface of the substrate, and a step of forming a second MEMS having the required characteristic by directly processing the first MEMS.